SBOS110C May   1998  – March 2023 OPA2227 , OPA2228 , OPA227 , OPA228 , OPA4227 , OPA4228

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information: OPA227, OPA228
    5. 6.5 Thermal Information: OPA2227, OPA2228
    6. 6.6 Thermal Information: OPA4227, OPA4228
    7. 6.7 Electrical Characteristics: OPAx227 
    8. 6.8 Electrical Characteristics: OPAx228 
    9. 6.9 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Offset Voltage and Drift
      2. 7.3.2 Operating Voltage
      3. 7.3.3 Offset Voltage Adjustment
      4. 7.3.4 Input Protection
      5. 7.3.5 Input Bias Current Cancellation
      6. 7.3.6 Noise Performance
      7. 7.3.7 Basic Noise Calculations
      8. 7.3.8 EMI Rejection Ratio (EMIRR)
        1. 7.3.8.1 EMIRR IN+ Test Configuration
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Using the OPAx228 in Low Gains
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Three-Pole, 20 kHz Low Pass, 0.5-dB Chebyshev Filter
      3. 8.2.3 Long-Wavelength Infrared Detector Amplifier
      4. 8.2.4 High Performance Synchronous Demodulator
      5. 8.2.5 Headphone Amplifier
      6. 8.2.6 Three-Band Active Tone Control (Bass, Midrange, and Treble)
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  9. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Development Support
        1. 9.1.1.1 TINA-TI™ Simulation Software (Free Download)
        2. 9.1.1.2 TI Reference Designs
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
    3. 9.3 Receiving Notification of Documentation Updates
    4. 9.4 Support Resources
    5. 9.5 Trademarks
    6. 9.6 Electrostatic Discharge Caution
    7. 9.7 Glossary
  10. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from Revision B (April 2015) to Revision C (November 2022)

  • Updated the numbering format for tables, figures, and cross-references throughout the documentGo
  • Added dual supply voltage in Absolute Maximum Ratings Go
  • Added symbol for output short circuit in Absolute Maximum Ratings Go
  • Added symbol for operating temperature in Absolute Maximum Ratings Go
  • Added symbol for junction temperature in Absolute Maximum Ratings Go
  • Changed HBM value in ESD Ratings Go
  • Added CDM in ESD Ratings Go
  • Changed to single supply voltage and dual supply voltage in Recommended Operating Conditions Go
  • Changed format of thermal information tables for better clarity.Go
  • Changed package to P (PDIP) for OPA222xP and OPA222xPA devices in Thermal Information Go
  • Deleted redundant power supply voltage from Electrical Characteristics of OPAx227 because same information already listed in Recommended Operating Conditions Go
  • Deleted redundant temperature from Electrical Characteristics of OPAx227 because same information already listed in Recommended Operating Conditions Go
  • Deleted redundant power supply voltage from Electrical Characteristics of OPAx228 because same information already listed in Recommended Operating ConditionsGo
  • Deleted redundant temperature from Electrical Characterisitcs of OPAx228 because same information already listed in Recommended Operating Conditions Go

Changes from Revision A (January 2005) to Revision B (April 2015)

  • Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information sectionGo