SBOS075A September   2000  – June 2024 OPA2241 , OPA2251 , OPA241 , OPA251 , OPA4241 , OPA4251

PRODUCTION DATA  

  1.   1
  2. 1Features
  3. 2Applications
  4. 3Description
  5. 4Pin Configuration and Functions
  6. 5Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 Recommended Operating Conditions
    3. 5.3 Thermal Information for OPA241 and OPA251
    4. 5.4 Thermal Information for OPA2241 and OPA2251
    5. 5.5 Thermal Information for OPA4241 and OPA4251
    6. 5.6 Electrical Characteristics for VS = 2.7V to 5V
    7. 5.7 Electrical Characteristics for VS = ±15V
    8. 5.8 Typical Characteristics
  7. 6Application and Implementation
    1. 6.1 Applications Information
      1. 6.1.1 Operating Voltage
      2. 6.1.2 Offset Voltage Trim
      3. 6.1.3 Capacitive Load and Stability
  8. 7Device and Documentation Support
    1. 7.1 Receiving Notification of Documentation Updates
    2. 7.2 Support Resources
    3. 7.3 Trademarks
    4. 7.4 Electrostatic Discharge Caution
    5. 7.5 Glossary
  9. 8Revision History
  10. 9Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|14
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.3 Thermal Information for OPA241 and OPA251

THERMAL METRIC(1) OPA241 AND OPA251 UNIT
D (SOIC) P (PDIP)
8 PINS 8 PINS
RθJA Junction-to-ambient thermal resistance 150 100 ℃/W
RθJC(top) Junction-to-case (top) thermal resistance 67.6 N/A ℃/W
RθJB Junction-to-board thermal resistance 75.4 N/A ℃/W
ψJT Junction-to-top characterization parameter 15.1 N/A ℃/W
ψJB Junction-to-board characterization parameter 74.2 N/A ℃/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A N/A ℃/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.