SBOSAA1H April   2022  – November 2024 OPA2310 , OPA310 , OPA4310

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information for Single Channel
    5. 6.5 Thermal Information for Dual Channel
    6. 6.6 Thermal Information for Quad Channel
    7. 6.7 Electrical Characteristics
    8. 6.8 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Operating Voltage
      2. 7.3.2  Rail-to-Rail Input
      3. 7.3.3  Rail-to-Rail Output
      4. 7.3.4  Capacitive Load and Stability
      5. 7.3.5  Overload Recovery
      6. 7.3.6  EMI Rejection
      7. 7.3.7  ESD and Electrical Overstress
      8. 7.3.8  Input ESD Protection
      9. 7.3.9  Shutdown Function
      10. 7.3.10 Packages with an Exposed Thermal Pad
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 OPAx310 Low-Side, Current Sensing Application
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4.     Trademarks
    5. 9.4 Electrostatic Discharge Caution
    6. 9.5 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.5 Thermal Information for Dual Channel

THERMAL METRIC (1) OPA2310 OPA2310S UNIT
DSG 
(WSON)		 D 
(SOIC)		 DDF (2)
(SOT-23-8)		 DGK 
(VSSOP)		 PW (2)
(TSSOP)		 DGQ (2)
(HVSSOP)		 RUG 
(X2QFN)
8 PINS 8 PINS 8 PINS 8 PINS 8 PINS 10 PINS 10 PINS
RθJA Junction-to-ambient thermal resistance 90.1 139.0 TBD 187.7 TBD TBD 179.4 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 112.1 81.2 TBD 78.1 TBD TBD 66.7 °C/W
RθJB Junction-to-board thermal resistance 56.3 82.4 TBD 109.5 TBD TBD 104.5 °C/W
ψJT Junction-to-top characterization parameter 9.2 31.3 TBD 17.9 TBD TBD 1.4 °C/W
ψJB Junction-to-board characterization parameter 56.3 81.6 TBD 107.9 TBD TBD 104.2 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 31.8 N/A TBD N/A TBD TBD n/a °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.
(2) This package option is on preview.