SBOS432G August   2008  – August 2016 OPA2330 , OPA330 , OPA4330

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configurations and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information: OPA330
    5. 7.5 Thermal Information: OPA2330
    6. 7.6 Thermal Information: OPA4330
    7. 7.7 Electrical Characteristics
    8. 7.8 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Operating Voltage
      2. 9.1.2 Input Voltage
      3. 9.1.3 Input Differential Voltage
      4. 9.1.4 Internal Offset Correction
      5. 9.1.5 EMI Susceptibility and Input Filtering
      6. 9.1.6 Achieving Output Swing to the Operational Amplifier Negative Rail
      7. 9.1.7 Photosensitivity
    2. 9.2 Typical Application
      1. 9.2.1 Bidirectional Current-Sensing
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curve
    3. 9.3 System Examples
      1. 9.3.1 Single Operational Amplifier Bridge Amplifier
      2. 9.3.2 Low-Side Current Monitor
      3. 9.3.3 Thermistor Measurement
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 VQFN and SON Packages
      2. 11.1.2 VQFN and SON Layout Guidelines
      3. 11.1.3 OPA330 DSBGA
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Development Support
        1. 12.1.1.1 TINA-TI™ (Free Software Download)
        2. 12.1.1.2 DIP Adapter EVM
        3. 12.1.1.3 Universal Operational Amplifier EVM
        4. 12.1.1.4 TI Precision Designs
        5. 12.1.1.5 WEBENCH Filter Designer
        6. 12.1.1.6 Related Parts
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Related Links
    4. 12.4 Receiving Notification of Documentation Updates
    5. 12.5 Community Resources
    6. 12.6 Trademarks
    7. 12.7 Electrostatic Discharge Caution
    8. 12.8 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|14
  • RGY|14
  • PW|14
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11 Layout

11.1 Layout Guidelines

TI always recommends paying attention to good layout practice. Keep traces short and, when possible, use a printed-circuit board (PCB) ground plane with surface-mount components placed as close to the device pins as possible. Place a 0.1-µF capacitor closely across the supply pins. These guidelines must be applied throughout the analog circuit to improve performance and provide benefits such as reducing the electromagnetic interference (EMI) susceptibility.

For lowest offset voltage and precision performance, circuit layout, and mechanical conditions must be optimized. Avoid temperature gradients that create thermoelectric (Seebeck) effects in the thermocouple junctions formed from connecting dissimilar conductors. These thermally-generated potentials can be made to cancel by assuring they are equal on both input terminals. Other layout and design considerations include:

  • Use low thermoelectric-coefficient conditions (avoid dissimilar metals).
  • Thermally isolate components from power supplies or other heat sources.
  • Shield operational amplifier and input circuitry from air currents, such as cooling fans.

Following these guidelines reduces the likelihood of junctions being at different temperatures, which can cause thermoelectric voltage drift of 0.1 µV/°C or higher, depending on materials used.

11.1.1 VQFN and SON Packages

The OPA4330 is offered in a VQFN package. The OPA2330 is available in a 8-pin SON package, which is a VQFN package with lead contacts on only two sides of the bottom of the package. These leadless, near-chip-scale packages maximize board space and enhance thermal and electrical characteristics through an exposed pad. VQFN and SON packages are physically small, have a smaller routing area, improved thermal performance, and improved electrical parasitics, with a pinout scheme that is consistent with other commonly-used packages, such as SOIC and VSSOP. Additionally, the absence of external leads eliminates bent-lead issues.

The VQFN and SON package can be easily mounted using standard PCB assembly techniques. See the application note, QFN/SON PCB Attachment (SLUA271), and the application report, Quad Flatpack No-Lead Logic Packages (SCBA017), both available for download at www.ti.com.

NOTE

The exposed leadframe die pad on the bottom of the package should be connected to V–.

11.1.2 VQFN and SON Layout Guidelines

The leadframe die pad must be soldered to a thermal pad on the PCB. A mechanical data sheet showing an example layout is attached at the end of this data sheet. Refinements to this layout may be required based on assembly process requirements. Mechanical drawings located at the end of this data sheet list the physical dimensions for the package and pad. The five holes in the landing pattern are optional, and are intended for use with thermal vias that connect the leadframe die pad to the heat sink area on the PCB.

Soldering the exposed pad significantly improves board-level reliability during temperature cycling, key push, package shear, and similar board-level tests. Even with applications that have low-power dissipation, the exposed pad must be soldered to the PCB to provide structural integrity and long-term reliability.

11.1.3 OPA330 DSBGA

The OPA330 YFF package is a lead- (Pb-) free, die-level, wafer chip-scale package. Unlike devices that are in plastic packages, these devices have no molding compound, lead frame, wire bonds, or leads. Using standard surface-mount assembly procedures, the OPA330 YFF can be mounted to a printed-circuit board (PCB) without additional underfill. Figure 26 and Figure 27 detail the pinout and package marking, respectively. See the application note, NanoStar™ and NanoFree™ 300μm Solder Bump WCSP (SBVA017) for more detailed information on package characteristics and PCB design.

OPA330 OPA2330 OPA4330 ai_pin_description_bos432.gif Figure 26. DSBGA Pin Description
OPA330 OPA2330 OPA4330 ai_tv_pkgmark_bos432.gif Figure 27. YFF Package Marking

11.2 Layout Example

OPA330 OPA2330 OPA4330 layout_example_bos620.gif Figure 28. OPAx330 Layout Example