SBOS233G March   2002  – April 2018 OPA2354 , OPA354 , OPA4354

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
    1.     Device Images
      1.      Simplified Schematic
  4. Revision History
  5. Device Comparison Table
  6. Pin Configuration and Functions
    1.     Pin Functions: OPA354
    2.     Pin Functions: OPA2354
    3.     Pin Functions: OPA4354
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information: OPA354
    5. 7.5 Thermal Information: OPA2354
    6. 7.6 Thermal Information: OPA4354
    7. 7.7 Electrical Characteristics: VS = 2.7 V to 5.5 V (Single-Supply)
    8. 7.8 Typical Characteristics
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Operating Voltage
      2. 8.3.2 Rail-to-Rail Input
      3. 8.3.3 Rail-to-Rail Output
      4. 8.3.4 Output Drive
      5. 8.3.5 Video
      6. 8.3.6 Driving Analog-to-Digital converters
      7. 8.3.7 Capacitive Load and Stability
      8. 8.3.8 Wideband Transimpedance Amplifier
    4. 8.4 Device Functional Modes
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Optimizing the Transimpedance Circuit
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
    3. 11.3 Power Dissipation
    4. 11.4 PowerPAD Thermally-Enhanced Package
    5. 11.5 PowerPAD Assembly Process
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
    2. 12.2 Related Links
    3. 12.3 Receiving Notification of Documentation Updates
    4. 12.4 Community Resources
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Device Comparison Table

FEATURES PRODUCT
Shutdown Version of OPAx354 Family OPAx357
200-MHz GBW, Rail-to-Rail Output, CMOS, Shutdown OPAx355
200-MHz GBW, Rail-to-Rail Output, CMOS OPAx356
38-MHz GBW, Rail-to-Rail Input/Output, CMOS OPAx350/OPAx353
75-MHz BW G = 2, Rail-to-Rail Output OPA2631
150-MHz BW G = 2, Rail-to-Rail Output OPA2634
100-MHz BW, Differential Input/Output, 3.3-V Supply THS412x