SBOS233G March   2002  – April 2018 OPA2354 , OPA354 , OPA4354

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Simplified Schematic
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
    1.     Pin Functions: OPA354
    2.     Pin Functions: OPA2354
    3.     Pin Functions: OPA4354
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information: OPA354
    5. 7.5 Thermal Information: OPA2354
    6. 7.6 Thermal Information: OPA4354
    7. 7.7 Electrical Characteristics: VS = 2.7 V to 5.5 V (Single-Supply)
    8. 7.8 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Operating Voltage
      2. 8.3.2 Rail-to-Rail Input
      3. 8.3.3 Rail-to-Rail Output
      4. 8.3.4 Output Drive
      5. 8.3.5 Video
      6. 8.3.6 Driving Analog-to-Digital converters
      7. 8.3.7 Capacitive Load and Stability
      8. 8.3.8 Wideband Transimpedance Amplifier
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Optimizing the Transimpedance Circuit
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
    3. 11.3 Power Dissipation
    4. 11.4 PowerPAD Thermally-Enhanced Package
    5. 11.5 PowerPAD Assembly Process
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
    2. 12.2 Related Links
    3. 12.3 Receiving Notification of Documentation Updates
    4. 12.4 Community Resources
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11.4 PowerPAD Thermally-Enhanced Package

In addition to the regular 5-pin SOT-23 and 9-pin VSSOP packages, the single and dual versions of the OPAx354 also come in an 8-pin SOIC PowerPAD package. The 98-pin SO with PowerPAD is a standard size 8-pin SOIC package where the exposed leadframe on the bottom of the package is soldered directly to the PCB to create a low thermal resistance. This direct attachment enhances the OPAx354 power dissipation capability significantly, and eliminates the use of bulky heat sinks and slugs that are traditionally used in thermal packages. This package is easily mounted using standard PCB assembly techniques.

NOTE

Because the 8-pin HSOP PowerPAD is pin-compatible with standard 8-pin SOIC packages, the OPA354 and OPA2354 can directly replace operational amplifiers in existing sockets. Soldering the PowerPAD to the PCB is always required, even with applications that have low power dissipation. This configuration provides the necessary thermal and mechanical connection between the leadframe die pad and the PCB.

The PowerPAD package is designed so that the leadframe die pad (or thermal pad) is exposed on the bottom of the device, as shown in Figure 40. This exposed die provides an extremely low thermal resistance (RθJC) path between the die and the exterior of the package. The thermal pad on the bottom of the device can then be soldered directly to the PCB, using the PCB as a heat sink. In addition, plated-through holes (vias) provide a low thermal resistance heat flow path to the back side of the PCB.

OPA354 OPA2354 OPA4354 ai_powerpad_xsection_bos233.gifFigure 40. Section View of a PowerPAD Package