SBOS259F September   2002  – June 2018 OPA2363 , OPA2364 , OPA363 , OPA364 , OPA4364

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Single-Supply Microphone Preamplifier
  4. 4 Revision History
  5. 5 Device Comparison Table
    1. 5.1 Device Comparison Table
  6. 6 Pin Configuration and Functions
    1.     Pin Functions: OPA363
    2.     Pin Functions: OPA2363
    3.     Pin Functions: OPA364
    4.     Pin Functions: OPA2364
    5.     Pin Functions: OPA4364
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information: OPA363
    5. 7.5  Thermal Information: OPA364
    6. 7.6  Thermal Information: OPA2363
    7. 7.7  Thermal Information: OPA2364
    8. 7.8  Thermal Information: OPA4364
    9. 7.9  Electrical Characteristics
    10. 7.10 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Rail-to-Rail Input
      2. 8.3.2 Operating Voltage
      3. 8.3.3 Capacitive Load
      4. 8.3.4 Input and ESD Protection
    4. 8.4 Device Functional Modes
      1. 8.4.1 Enable Function
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Achieving Output Swing to the Op Amp Negative Rail
      2. 9.1.2 Directly Driving the ADS8324 and the MSP430
      3. 9.1.3 Audio Applications
      4. 9.1.4 Active Filtering
    2. 9.2 Typical Application
      1. 9.2.1 Single-Supply Electret Microphone Preamplifier
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Development Support
        1. 12.1.1.1 TINA-TI™ (Free Software Download)
        2. 12.1.1.2 DIP Adapter EVM
        3. 12.1.1.3 Universal Op Amp EVM
        4. 12.1.1.4 TI Precision Designs
        5. 12.1.1.5 WEBENCH Filter Designer
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Related Links
    4. 12.4 Receiving Notification of Documentation Updates
    5. 12.5 Community Resource
    6. 12.6 Trademarks
    7. 12.7 Electrostatic Discharge Caution
    8. 12.8 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11.1 Layout Guidelines

For best operational performance of the device, use good printed-circuit board (PCB) layout practices, including:

  • Noise can propagate into analog circuitry through the power pins of the circuit as a whole and of op amp itself. Bypass capacitors reduce the coupled noise by providing low-impedance power sources local to the analog circuitry.
    • Connect low-ESR, 0.1-µF ceramic bypass capacitors between each supply pin and ground, placed as close to the device as possible. A single bypass capacitor from V+ to ground is applicable for single-supply applications.
  • Separate grounding for analog and digital portions of circuitry is one of the simplest and most effective methods of noise suppression. One or more layers on multilayer PCBs are usually devoted to ground planes. A ground plane helps distribute heat and reduces EMI noise pickup. Make sure to physically separate digital and analog grounds, paying attention to the flow of the ground current.
  • To reduce parasitic coupling, run the input traces as far away from the supply or output traces as possible. If these traces cannot be kept separate, crossing the sensitive trace perpendicular is much better as opposed to in parallel with the noisy trace.
  • Place the external components as close to the device as possible. As shown in Figure 33, keeping RF and RG close to the inverting input minimizes parasitic capacitance.
  • Keep the length of input traces as short as possible. Always remember that the input traces are the most sensitive part of the circuit.
  • Consider a driven, low-impedance guard ring around the critical traces. A guard ring can significantly reduce leakage currents from nearby traces that are at different potentials.
  • Cleaning the PCB following board assembly is recommended for best performance.
  • Any precision integrated circuit can experience performance shifts resulting from moisture ingress into the plastic package. Following any aqueous PCB cleaning process, baking the PCB assembly is recommended to remove moisture introduced into the device packaging during the cleaning process. A low temperature, post-cleaning bake at 85°C for 30 minutes is sufficient for most circumstances.