SBOS259F September   2002  – June 2018 OPA2363 , OPA2364 , OPA363 , OPA364 , OPA4364

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Single-Supply Microphone Preamplifier
  4. 4 Revision History
  5. 5 Device Comparison Table
    1. 5.1 Device Comparison Table
  6. 6 Pin Configuration and Functions
    1.     Pin Functions: OPA363
    2.     Pin Functions: OPA2363
    3.     Pin Functions: OPA364
    4.     Pin Functions: OPA2364
    5.     Pin Functions: OPA4364
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information: OPA363
    5. 7.5  Thermal Information: OPA364
    6. 7.6  Thermal Information: OPA2363
    7. 7.7  Thermal Information: OPA2364
    8. 7.8  Thermal Information: OPA4364
    9. 7.9  Electrical Characteristics
    10. 7.10 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Rail-to-Rail Input
      2. 8.3.2 Operating Voltage
      3. 8.3.3 Capacitive Load
      4. 8.3.4 Input and ESD Protection
    4. 8.4 Device Functional Modes
      1. 8.4.1 Enable Function
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Achieving Output Swing to the Op Amp Negative Rail
      2. 9.1.2 Directly Driving the ADS8324 and the MSP430
      3. 9.1.3 Audio Applications
      4. 9.1.4 Active Filtering
    2. 9.2 Typical Application
      1. 9.2.1 Single-Supply Electret Microphone Preamplifier
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Development Support
        1. 12.1.1.1 TINA-TI™ (Free Software Download)
        2. 12.1.1.2 DIP Adapter EVM
        3. 12.1.1.3 Universal Op Amp EVM
        4. 12.1.1.4 TI Precision Designs
        5. 12.1.1.5 WEBENCH Filter Designer
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Related Links
    4. 12.4 Receiving Notification of Documentation Updates
    5. 12.5 Community Resource
    6. 12.6 Trademarks
    7. 12.7 Electrostatic Discharge Caution
    8. 12.8 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.7 Thermal Information: OPA2364

THERMAL METRIC(1) OPA2364 UNIT
D (SOIC) DGK (VSSOP) DGS (VSSOP) UQFN (RSV)
8 PINS 8 PINS 10 PINS 16 PINS
RθJA Junction-to-ambient thermal resistance 125.3 171.8 166.4 112.4 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 73.7 63.2 55.9 44 °C/W
RθJB Junction-to-board thermal resistance 65.7 92.4 86.6 41.2 °C/W
ψJT Junction-to-top characterization parameter 25.4 9.5 6.8 0.8 °C/W
ψJB Junction-to-board characterization parameter 65.2 91 85.2 41.2 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance — — — — °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.