SBOS549 Data sheet | TI.com

SBOS549C April 2011 – March 2021 OPA2376-Q1 , OPA376-Q1 , OPA4376-Q1

PRODUCTION DATA

Package Options

Mechanical Data (Package|Pins)

PW|14
- MPDS360A

Thermal pad, mechanical data (Package|Pins)

Orderable Information

6.8 Typical Characteristics

at T_A = 25°C, V_S = 5 V, R_L = 10 kΩ connected to V_S / 2, V_CM = V_S / 2, and V_OUT = V_S / 2 (unless otherwise noted)

Figure 6-1 Open-Loop Gain and Phase vs Frequency

Figure 6-3 Open-Loop Gain and Power-Supply Rejection Ratio vs Temperature

Figure 6-5 Input Voltage Noise Spectral Density

Figure 6-7 Common-Mode Rejection Ratio vs Temperature

(V–) = 0 V

T_A = 125°C

Figure 6-9 Offset Voltage vs Common-Mode Voltage

Figure 6-11 Quiescent and Short-Circuit Current vs Supply Voltage

Figure 6-13 Input Bias Current vs Temperature

Figure 6-15 Offset Voltage Production Distribution

Figure 6-17 Maximum Output Voltage vs Frequency

Figure 6-19 Small-Signal Pulse Response

Figure 6-21 Settling Time vs Closed-Loop Gain

Figure 6-23 Open-Loop Output Resistance vs Frequency

Figure 6-2 Power-Supply and Common-Mode Rejection Ratio vs Frequency

Figure 6-4 0.1-Hz to 10-Hz Input Voltage Noise

Figure 6-6 Total Harmonic Distortion + Noise vs Frequency

V_CM range for typical CMRR = 90 dB

Figure 6-8 Common-Mode Voltage vs Temperature

Figure 6-10 Quiescent Current vs Temperature

Figure 6-12 Short-Circuit Current vs Temperature

Figure 6-14 Output Voltage vs Output Current

Figure 6-16 Offset Voltage Drift Production Distribution
(–40°C to +125°C)

Figure 6-18 Small-Signal Overshoot vs Load Capacitance

Figure 6-20 Large-Signal Pulse Response

Figure 6-22 Channel Separation vs Frequency