SBOS797A May   2016  – May 2016 OPA2377-Q1 , OPA377-Q1 , OPA4377-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information: OPA377-Q1
    5. 6.5 Thermal Information: OPA2377-Q1
    6. 6.6 Thermal Information: OPA4377-Q1
    7. 6.7 Electrical Characteristics: VS = 2.2 V to 5.5 V
    8. 6.8 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Operating Characteristics
      2. 7.3.2 Common-Mode Voltage Range
      3. 7.3.3 Input and ESD Protection
      4. 7.3.4 EMI Susceptibility and Input Filtering
      5. 7.3.5 Capacitive Load and Stability
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
        1. 11.1.1.1 TINA-TI™ (Free Software Download)
        2. 11.1.1.2 DIP Adapter EVM
        3. 11.1.1.3 Universal Op Amp EVM
        4. 11.1.1.4 TI Precision Designs
        5. 11.1.1.5 WEBENCH Filter Designer
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
VS = (V+) – (V–) Supply voltage 7 V
Signal input terminal voltage(2) (V–) – 0.5 (V+) + 0.5 V
Signal input terminal current(2) –10 10 mA
Output short-circuit current(3) Continuous
TA Operating temperature –40 150 °C
TJ Junction temperature 150 °C
Tstg Storage temperature –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) Input terminals are diode-clamped to the power-supply rails. Input signals that can swing more than 0.5 V beyond the supply rails should be current limited to 10 mA or less.
(3) Short-circuit to ground, one amplifier per package.

6.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human-body model (HBM), per AEC Q100-002(1) ±4000 V
Charged-device model (CDM), per AEC Q100-011 ±1000
(1) AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
Supply voltage 2.2 5.5 V
TA Operating temperature –40 150 °C

6.4 Thermal Information: OPA377-Q1

THERMAL METRIC(1) OPA377-Q1 UNIT
DBV (SOT23)
5 PINS
RθJA Junction-to-ambient thermal resistance 273.8 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 126.8 °C/W
RθJB Junction-to-board thermal resistance 85.9 °C/W
ψJT Junction-to-top characterization parameter 10.9 °C/W
ψJB Junction-to-board characterization parameter 84.9 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance n/a °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.

6.5 Thermal Information: OPA2377-Q1

THERMAL METRIC(1) OPA2377-Q1 UNIT
DGK (VSSOP)
8 PINS
RθJA Junction-to-ambient thermal resistance 171.2 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 63.9 °C/W
RθJB Junction-to-board thermal resistance 92.8 °C/W
ψJT Junction-to-top characterization parameter 9.2 °C/W
ψJB Junction-to-board characterization parameter 91.2 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance n/a °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.

6.6 Thermal Information: OPA4377-Q1

THERMAL METRIC(1) OPA4377-Q1 UNIT
PW (TSSOP)
14 PINS
RθJA Junction-to-ambient thermal resistance 107.8 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 29.6 °C/W
RθJB Junction-to-board thermal resistance 52.6 °C/W
ψJT Junction-to-top characterization parameter 1.5 °C/W
ψJB Junction-to-board characterization parameter 51.6 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance n/a °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.

6.7 Electrical Characteristics: VS = 2.2 V to 5.5 V

At TA = 25°C, RL = 10 kΩ connected to VS/2, VCM = VS/2, and VOUT = VS/2, unless otherwise noted.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
OFFSET VOLTAGE
VOS Input offset voltage VS = 5 V 0.25 1 mV
Input offset voltage
versus temperature		 At TA = –40°C to +125°C, VS = 2.2 V to 5.5 V,
VCM < (V+) – 1.3 V		 5 µV/V
dVOS/dT Input offset voltage
versus drift		 At TA = –40°C to +125°C 0.32 2 μV/°C
PSRR Input offset voltage
versus power supply		 At TA = 25°C, VS = 2.2 V to 5.5 V,
VCM < (V+) – 1.3 V		 5 28 μV/V
Channel separation, dc (dual, quad) 0.5 µV/V
INPUT BIAS CURRENT
IIB Input bias current ±0.2 ±10 pA
Input bias current
versus temperature		 See Typical Characteristics pA
IOS Input offset current ±0.2 ±10 pA
NOISE
Input voltage noise f = 0.1 Hz to 10 Hz 0.8 μVPP
en Input voltage noise density f = 1 kHz 7.5 nV/√Hz
in Input current noise density f = 1 kHz 2 fA/√Hz
INPUT VOLTAGE RANGE
VCM Common-mode voltage range (V–) – 0.1 (V+) + 0.1 V
CMRR Common-mode rejection ratio (V–) < VCM < (V+) – 1.3 V 70 90 dB
INPUT CAPACITANCE
Differential 6.5 pF
Common-mode 13 pF
OPEN-LOOP GAIN
AOL Open-loop voltage gain 50 mV < VO < (V+) – 50 mV, RL = 10 kΩ 112 134 dB
100 mV < VO < (V+) – 100 mV, RL = 2 kΩ 126 dB
FREQUENCY RESPONSE, VS = 5.5 V
GBW Gain-bandwidth product 5.5 MHz
SR Slew rate G = +1 2 V/μs
tS Settling time At 0.1%, 2-V step, G = +1 1.6 μs
At 0.01%, 2-V step, G = +1 2 μs
Overload recovery time VIN  × Gain > VS 0.33 μs
THD+N Total harmonic distortion + noise VO = 1 VRMS, G = +1, f = 1 kHz, RL = 10 kΩ 0.00027%
OUTPUT
Voltage output swing from rail At TA = 25°C, RL = 10 kΩ 10 20 mV
At TA = –40°C to +125°C, RL = 10 kΩ 40 mV
ISC Short-circuit current +30/–50 mA
CLOAD Capacitive load drive See Typical Characteristics
RO Open-loop output impedance 150 Ω
POWER SUPPLY
VS Specified voltage 2.2 5.5 V
IQ Quiescent current
(per amplifier)		 At TA = 25°C, IO = 0, VS = 5.5 V 0.76 1.05 mA
At TA = –40°C to +125°C 1.2 mA
TEMPERATURE
Specified temperature –40 +125 °C

6.8 Typical Characteristics

At TA = 25°C, VS = 5 V, RL = 10 kΩ connected to VS/2, VCM = VS/2, and VOUT = VS/2, unless otherwise noted.
OPA377-Q1 OPA2377-Q1 OPA4377-Q1 tc_open_gp-freq_bos406.gif
Figure 1. Open-Loop Gain and Phase vs Frequency
OPA377-Q1 OPA2377-Q1 OPA4377-Q1 tc_open_psrr-tmp_bos406.gif
Figure 3. Open-Loop Gain and Power-Supply
Rejection Ratio vs Temperature
OPA377-Q1 OPA2377-Q1 OPA4377-Q1 tc_v_noise_bos406.gif
Figure 5. Input Voltage Noise Spectral Density
OPA377-Q1 OPA2377-Q1 OPA4377-Q1 tc_cmrr-tmp_bos406.gif
Figure 7. Common-Mode Rejection Ratio
vs Temperature
OPA377-Q1 OPA2377-Q1 OPA4377-Q1 tc_iq_cur-sv_bos406.gif
Figure 9. Quiescent and Short-Circuit Current
vs Supply Voltage
OPA377-Q1 OPA2377-Q1 OPA4377-Q1 tc_ibc-tmp_bos406.gif
Figure 11. Input Bias Current vs Temperature
OPA377-Q1 OPA2377-Q1 OPA4377-Q1 tc_histo_vo_bos504.gif
Figure 13. Offset Voltage
Production Distribution
OPA377-Q1 OPA2377-Q1 OPA4377-Q1 tc_ss-load_cap_bos406.gif
Figure 15.

Small-Signal Overshoot vs Load Capacitance
OPA377-Q1 OPA2377-Q1 OPA4377-Q1 tc_resp_lg_bos406.gif
Figure 17. Large-Signal Pulse Response
OPA377-Q1 OPA2377-Q1 OPA4377-Q1 tc_ch_sep-frq_bos406.gif
Figure 19. Channel Separation vs Frequency
OPA377-Q1 OPA2377-Q1 OPA4377-Q1 C013_SBOS504.gif
Figure 21. Input Offset Voltage vs Common-Mode Voltage
OPA377-Q1 OPA2377-Q1 OPA4377-Q1 tc_ps-cmrr-freq_bos406.gif
Figure 2. Power-Supply and Common-Mode
Rejection Ratio vs Frequency
OPA377-Q1 OPA2377-Q1 OPA4377-Q1 tc_input_vr_bos406.gif
Figure 4. 0.1-Hz to 10-Hz Input Voltage Noise
OPA377-Q1 OPA2377-Q1 OPA4377-Q1 tc_hd-freq_bos406.gif
Figure 6. Total Harmonic Distortion and Noise
vs Frequency
OPA377-Q1 OPA2377-Q1 OPA4377-Q1 tc_iq-tmp_bos406.gif
Figure 8. Quiescent Current
vs Temperature
OPA377-Q1 OPA2377-Q1 OPA4377-Q1 tc_short_cir-tmp_bos406.gif
Figure 10. Short-Circuit Current
vs Temperature
OPA377-Q1 OPA2377-Q1 OPA4377-Q1 tc_outv_outc_bos406.gif
Figure 12. Output Voltage vs Output Current
OPA377-Q1 OPA2377-Q1 OPA4377-Q1 tc_max_out-frq_bos406.gif
Figure 14. Maximum Output Voltage vs Frequency
OPA377-Q1 OPA2377-Q1 OPA4377-Q1 tc_resp_sm_bos406.gif
Figure 16.

Small-Signal Pulse Response
OPA377-Q1 OPA2377-Q1 OPA4377-Q1 tc_set_tim-closed_bos406.gif
Figure 18. Settling Time vs Closed-Loop Gain
OPA377-Q1 OPA2377-Q1 OPA4377-Q1 tc_oloop_ro-frq_bos406.gif
Figure 20. Open-Loop Output Resistance vs Frequency