SBOS777D November   2016  – July 2020 OPA2388 , OPA388 , OPA4388

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information: OPA388
    5. 6.5 Thermal Information: OPA2388
    6. 6.6 Thermal Information: OPA4388
    7. 6.7 Electrical Characteristics: VS = ±1.25 V to ±2.75 V (VS = 2.5 to 5.5 V)
    8. 6.8 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Operating Voltage
      2. 7.3.2 Input Voltage and Zero-Crossover Functionality
      3. 7.3.3 Input Differential Voltage
      4. 7.3.4 Internal Offset Correction
      5. 7.3.5 EMI Susceptibility and Input Filtering
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Bidirectional Current-Sensing
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curve
      2. 8.2.2 Single Operational Amplifier Bridge Amplifier
      3. 8.2.3 Precision, Low-Noise, DAC Buffer
      4. 8.2.4 Load Cell Measurement
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
        1. 11.1.1.1 TINA-TI™ Simulation Software (Free Download)
        2. 11.1.1.2 TI Precision Designs
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Related Links
    4. 11.4 Receiving Notification of Documentation Updates
    5. 11.5 Support Resources
    6. 11.6 Trademarks
    7. 11.7 Electrostatic Discharge Caution
    8. 11.8 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from Revision C (May 2019) to Revision D (July 2020)

  • Changed OPA2388 SOIC-8 (D) package from advanced information (preview) to production data (active) Go
  • Changed typical application schematic to show correct locations for reference designatorsGo
  • Changed Figure 8-5 to show correct locations for reference designators Go

Changes from Revision B (January 2019) to Revision C (May 2019)

  • Changed OPA4388 from advanced information (preview) to production data (active)Go
  • Added VOS specifications for OPA4388.Go
  • Added dVOS/dT specifications for OPA4388Go
  • Added PSRR specifications for OPA4388Go
  • Added IB specifications for OPA4388Go
  • Added IOS specifications for OPA4388Go
  • Added CMRR specifications for OPA4388Go
  • Added AOL specifications for OPA4388Go

Changes from Revision A (July 2018) to Revision B (January 2019)

  • Changed OPA388 DBV (SOT-23) package from preview to production data Go
  • Deleted redundant temperature specification in EC table.Go
  • Added Figure 6, Offset Voltage vs Supply Voltage: OPA4388 Go
  • Added Figure 7, Offset Voltage Long Term Drift Go
  • Changed Figure 50, OPA388 Layout Example; updated for accuracyGo

Changes from Revision * (December 2016) to Revision A (July 2018)

  • Changed device status from Production Data to Production Data/Mixed StatusGo
  • Added top navigator link for TI reference designGo
  • Added preview notes to 5-pin SOT-23 (OPA388), 8-pin SOIC (OPA2388), 14-pin SOIC, and 14-pin TSSOP (OPA4388) packages in Device Information tableGo
  • Added package preview notes to Pin Configuration and Functions sectionGo
  • AOL test condition changed to 0.15 V from 0.1 VGo
  • AOL test condition changed to 0.15 V from 0.1 VGo
  • AOL test condition changed to 0.25 V from 0.2 VGo
  • AOL test condition changed to 0.3 V from 0.25 VGo