SBOS925E December   2020  – October 2024 OPA2391 , OPA391 , OPA4391

PRODMIX  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information: OPA391
    5. 5.5 Thermal Information: OPA2391
    6. 5.6 Thermal Information: OPA4391
    7. 5.7 Electrical Characteristics: OPA391DCK and OPA2391YBJ
    8. 5.8 Electrical Characteristics: OPA2391DGK and OPA4391PW
    9. 5.9 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Low Input Bias Current
      2. 6.3.2 Input Differential Voltage
      3. 6.3.3 Capacitive Load Drive
      4. 6.3.4 EMI Rejection
    4. 6.4 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Applications
      1. 7.2.1 Three-Terminal CO Gas Sensor
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
        3. 7.2.1.3 Application Curve
      2. 7.2.2 4-mA to 20-mA Loop Design
        1. 7.2.2.1 Application Curve
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Development Support
        1. 8.1.1.1 PSpice® for TI
        2. 8.1.1.2 TINA-TI™ Simulation Software (Free Download)
    2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation
    3. 8.3 Receiving Notification of Documentation Updates
    4. 8.4 Support Resources
    5. 8.5 Trademarks
    6. 8.6 Electrostatic Discharge Caution
    7. 8.7 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • PW|14
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.5 Thermal Information: OPA2391

THERMAL METRIC(1) OPA2391 UNIT
D (SOIC) DGK (VSSOP) YBJ (DSBGA)
8 PINS 8 PINS 9 PINS
RθJA Junction-to-ambient thermal resistance 132.8 152.1 110.7 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 72.7 61.7 0.7 °C/W
RθJB Junction-to-board thermal resistance 76.3 86.8 32.1 °C/W
ΨJT Junction-to-top characterization parameter 22.6 5.2 0.3 °C/W
ΨJB Junction-to-board characterization parameter 75.6 85.5 32.1 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A N/A N/A °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.