SBOSA16
October 2020
OPA455
PRODUCTION DATA
1
Features
2
Applications
3
Description
4
Revision History
5
Pin Configuration and Functions
6
Specifications
6.1
Absolute Maximum Ratings
6.2
ESD Ratings
6.3
Recommended Operating Conditions
6.4
Thermal Information
6.5
Electrical Characteristics
6.6
Typical Characteristics
7
Detailed Description
7.1
Overview
7.2
Functional Block Diagram
7.3
Feature Description
7.3.1
Status Flag Pin
7.3.2
Thermal Protection
7.3.3
Current Limit
7.3.4
Enable and Disable
7.4
Device Functional Modes
8
Application and Implementation
8.1
Application Information
8.2
Typical Applications
8.2.1
High DAC Gain Stage for Semiconductor Test Equipment
8.2.1.1
Design Requirements
8.2.1.2
Detailed Design Procedure
8.2.1.3
Application Curve
8.2.2
Improved Howland Current Pump for Bioimpedance Measurements in Multiparameter Patient Monitors
8.2.2.1
Design Requirements
8.2.2.2
Detailed Design Procedure
9
Power Supply Recommendations
10
Layout
10.1
Layout Guidelines
10.1.1
Thermally-Enhanced PowerPAD™ Package
10.1.2
PowerPAD™ Integrated Circuit Package Layout Guidelines
10.1.3
Pin Leakage
10.1.4
Thermal Protection
10.1.5
Power Dissipation
10.1.6
Heat Dissipation
10.2
Layout Example
11
Device and Documentation Support
11.1
Device Support
11.1.1
Development Support
11.1.1.1
TINA-TI™ Simulation Software (Free Download)
11.1.1.2
TI Precision Designs
11.1.1.3
WEBENCH® Filter Designer
11.2
Documentation Support
11.2.1
Related Documentation
11.3
Support Resources
11.4
Trademarks
11.5
Electrostatic Discharge Caution
11.6
Glossary
12
Mechanical, Packaging, and Orderable Information
Package Options
Mechanical Data (Package|Pins)
DDA|8
MPDS092F
Thermal pad, mechanical data (Package|Pins)
DDA|8
PPTD043J
Orderable Information
sbosa16_oa
sbosa16_pm
8.2
Typical Applications