SBOS070D October   1997  – December 2019 OPA548

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
    1.     Simplified Schematic
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Adjustable Current Limit
      2. 7.3.2 Enable/Status (E/S) Pin
      3. 7.3.3 Thermal Shutdown Status
    4. 7.4 Device Functional Modes
      1. 7.4.1 Output Disable
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Basic Circuit Connections
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Power Supply Requirements
          2. 8.2.1.2.2 Gain Setting and Input Configuration
          3. 8.2.1.2.3 Current Limit
          4. 8.2.1.2.4 Safe-Operating-Area
          5. 8.2.1.2.5 Heat Sinking
        3. 8.2.1.3 Application Curve
      2. 8.2.2 Monitoring Single- and Dual-Supplies
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
          1. 8.2.2.2.1 Output Disable and Thermal Shutdown Status
      3. 8.2.3 Programmable Power Supply
    3. 8.3 System Examples
  9. 9 Power Supply Recommendations
    1. 9.1 Output Stage Compensation
    2. 9.2 Output Protection
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Safe Operating Area
      2. 10.1.2 Amplifier Mounting
      3. 10.1.3 Power Dissipation
      4. 10.1.4 Thermal Considerations
      5. 10.1.5 Heat Sinking
        1. 10.1.5.1 Heat Sink Selection Example
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Support Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11.2.1 Related Documentation

Texas Instruments, Heat Sinking — TO-3 Thermal ModelSBOA021 applicaiton bulletin