SBOS567A June   2011  – February 2024 OPA564-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Adjustable Current Limit
        1. 7.3.1.1 Setting the Current Limit
      2. 7.3.2 Enable and Shutdown (E/S) Pin
      3. 7.3.3 Input Protection
      4. 7.3.4 Output Shutdown
      5. 7.3.5 Microcontroller Compatibility
      6. 7.3.6 Current Limit Flag
      7. 7.3.7 Thermal Protection
      8. 7.3.8 Junction Temperature Measurement Using TSENSE
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Basic Configuration
      2. 8.1.2 Output-Stage Compensation
      3. 8.1.3 Output Protection
      4. 8.1.4 Power Dissipation and Safe Operating Area
    2. 8.2 Typical Applications
      1. 8.2.1 Improved Howland Current Pump
      2. 8.2.2 Programmable Power Supply
      3. 8.2.3 Powerline Communication
      4. 8.2.4 Motor-Drive Circuit
      5. 8.2.5 DC Motor-Speed Controller (Without Tachometer)
      6. 8.2.6 Generating VDIG
      7. 8.2.7 Temperature Measurement
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
        1. 8.4.1.1 Thermally Enhanced PowerPAD™ Integrated Circuit Package
          1. 8.4.1.1.1 Bottom-Side Thermal Pad Assembly Process
  10. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DWP|20
Thermal pad, mechanical data (Package|Pins)
Orderable Information

3 Description

The OPA564-Q1 is a low-cost, high-current op amp that is an excellent choice for driving up to 1.5A into reactive loads. The high slew rate provides 1.3MHz of full-power bandwidth and excellent linearity. These monolithic integrated circuits provide high reliability in demanding powerline-communications and motor-control applications.

The OPA564-Q1 operates from a single supply of 7V to 24V, or dual power supplies of ±3.5V to ±12V. In single-supply operation, the input common-mode range extends to the negative supply. At maximum output current, a wide output swing provides a 20VPP (IOUT = 1.5A) capability with a nominal 24V supply.

The OPA564-Q1 is internally protected against overtemperature conditions and current overloads. This device provides an accurate, user-selected current limit. Two flag outputs are provided: one indicates current limit and the other shows a thermal overtemperature condition. The device also has an enable and shutdown (E/S) pin that can be forced low to shut down the output, effectively disconnecting the load.

The OPA564-Q1 is housed in a thermally enhanced, surface-mount PowerPAD integrated circuit package (HSOIC-20).

Package Information
PART NUMBER(1) PACKAGE(2) PACKAGE SIZE(3)
OPA564-Q1 DWP (HSOIC, 20) 12.825mm × 10.405mm
(1) See Section 4.
(2) For more information, see Section 11.
(3) The package size (length × width) is a nominal value and includes pins, where applicable.
GUID-20231219-SS0I-W9ZC-VBMS-CSTLRGBHSMTM-low.gif Improved Howland Current Pump