SBOSA42 June   2024 OPA596

ADVANCE INFORMATION  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Mux-Friendly Inputs
      2. 6.3.2 Thermal Protection
      3. 6.3.3 Slew Boost
      4. 6.3.4 Overload Recovery
    4. 6.4 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Applications
      1. 7.2.1 Bridge-Connected Piezoelectric Driver
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
      2. 7.2.2 DAC Output Gain and Buffer
        1. 7.2.2.1 Design Requirements
        2. 7.2.2.2 Detailed Design Procedure
      3. 7.2.3 Single-Supply Piezoelectric Driver
      4. 7.2.4 High-Side Current Sense
      5. 7.2.5 High-Voltage Instrumentation Amplifier
      6. 7.2.6 Composite Amplifier
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
        1. 7.4.1.1 Thermal Considerations
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Receiving Notification of Documentation Updates
    2. 8.2 Support Resources
    3. 8.3 Trademarks
    4. 8.4 Electrostatic Discharge Caution
    5. 8.5 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information
    1. 10.1 Tape and Reel Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DBV|5
Thermal pad, mechanical data (Package|Pins)
Orderable Information

3 Description

The OPA596 and OPA2596 (OPAx596) are high-voltage (85V), high slew rate (100V/μs), micro-power (420μA), unity-gain stable operational amplifiers (op amps).

The OPAx596 enable the next generation of high-voltage systems, such as output load drivers in semiconductor test and digital power supplies by increasing the output voltage of the system though high-gain configurations. Low power consumption and industry-standard small packages allow the device to be used in high-density systems that are size constrained, while reducing the thermal management requirements for the system.

Through proprietary design techniques, the OPAx596 are capable of a very high slew rate with minimal power consumption to improve large-signal settling time and maximize the effective large-signal bandwidth. These devices also offers mux-friendly inputs that enable large differential voltage (up to 85V) and help improve settling behavior when compared to traditional inputs in multiplexed applications.

The OPAx596 are available in industry-standard packages and operates across the temperature range of –40°C to +125°C.

Device Information
PART NUMBER CHANNELS PACKAGE(1)
OPA596 Single DBV (SOT-23, 5)
OPA2596(2) Dual DGK (VSSOP, 8)
(1) For more information, see Section 10.
(2) Preview information.

 

OPA596 DAC Output Buffer With Gain DAC Output Buffer With Gain