SBOS165B September   2000  – April 2024 OPA627 , OPA637

PRODMIX  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information: OPA627
    5. 5.5 Thermal Information: OPA637
    6. 5.6 Electrical Characteristics: OPA627BU, OPA627AU
    7. 5.7 Electrical Characteristics: OPA627AM, OPA627BM, OPA627SM
    8. 5.8 Electrical Characteristics: OPA637
    9. 5.9 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Offset Voltage Adjustment
      2. 6.3.2 Noise Performance
      3. 6.3.3 Input Bias Current
      4. 6.3.4 Phase-Reversal Protection
      5. 6.3.5 Output Overload
      6. 6.3.6 Capacitive Loads
      7. 6.3.7 Input Protection
      8. 6.3.8 EMI Rejection Ratio (EMIRR)
        1. 6.3.8.1 EMIRR IN+ Test Configuration
      9. 6.3.9 Settling Time
    4. 6.4 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
      3. 7.2.3 Application Curve
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Development Support
        1. 8.1.1.1 TINA-TI™ Simulation Software (Free Download)
        2. 8.1.1.2 Analog Filter Designer
        3. 8.1.1.3 TI Reference Designs
    2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation
    3. 8.3 Receiving Notification of Documentation Updates
    4. 8.4 Support Resources
    5. 8.5 Trademarks
    6. 8.6 Electrostatic Discharge Caution
    7. 8.7 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|8
  • LMC|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.4 Thermal Information: OPA627

THERMAL METRIC(1) OPA627 UNIT
D (SOIC) LMC (TO-99)
8 PINS 8 PINS
RθJA Junction-to-ambient thermal resistance  121.5 200 ℃/W
RθJC(top) Junction-to-case (top) thermal resistance 64.3 N/A ℃/W
RθJB Junction-to-board thermal resistance 65.0 N/A ℃/W
ψJT Junction-to-top characterization parameter 18.0 N/A ℃/W
ψJB Junction-to-board characterization parameter 64.3 N/A ℃/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A N/A ℃/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.