SBOS223H December 2001 – October 2024 OPA690
PRODUCTION DATA
Refer to the PDF data sheet for device specific package drawings
THERMAL METRIC(1) | OPA690 | UNIT | ||
---|---|---|---|---|
D (SOIC) | DBV (SOT-23) | |||
8 PINS | 6 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 125 | 171.6 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 70 | 110.6 | °C/W |
RθJB | Junction-to-board thermal resistance | 65.3 | 85.1 | °C/W |
ψJT | Junction-to-top characterization parameter | 25.6 | 53.9 | °C/W |
ψJB | Junction-to-board characterization parameter | 64.8 | 84.9 | °C/W |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | N/A | °C/W |