SBOS293I December   2003  – October 2024 OPA695

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics VS = ±5 V, OPA695ID, OPA695IDBV
    6. 5.6  Electrical Characteristics VS = 5 V, OPA695ID, OPA695IDBV
    7. 5.7  Electrical Characteristics VS = ±5 V, OPA695IDGK
    8. 5.8  Electrical Characteristics VS = 5 V, OPA695IDGK
    9. 5.9  Typical Characteristics: VS = ±5 V, OPA695IDBV, OPA695ID
    10. 5.10 Typical Characteristics: VS = 5 V, OPA695IDBV, OPA695ID
    11. 5.11 Typical Characteristics: VS = ±5 V, OPA695IDGK
    12. 5.12 Typical Characteristics: VS = 5 V, OPA695IDGK
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Wideband Current-Feedback Operation
      2. 6.3.2 Input and ESD Protection
    4. 6.4 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Operating Suggestions
        1. 7.1.1.1 Setting Resistor Values to Optimize Bandwidth
        2. 7.1.1.2 Output Current and Voltage
        3. 7.1.1.3 Driving Capacitive Loads
        4. 7.1.1.4 Distortion Performance
        5. 7.1.1.5 Noise Performance
        6. 7.1.1.6 Thermal Analysis
      2. 7.1.2 LO Buffer Amplifier
      3. 7.1.3 Wideband Cable Driving Applications
        1. 7.1.3.1 Cable Modem Return Path Driver
        2. 7.1.3.2 Arbitrary Waveform Driver
      4. 7.1.4 Differential I/O Applications
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
        1. 7.2.1.1 Saw Filter Buffer
      2. 7.2.2 Detailed Design Procedure
      3. 7.2.3 Application Curve
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Design-In Tools
        1. 8.1.1.1 Demonstration Fixtures
    2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation
    3. 8.3 Receiving Notification of Documentation Updates
    4. 8.4 Support Resources
    5. 8.5 Trademarks
    6. 8.6 Electrostatic Discharge Caution
    7. 8.7 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|8
  • DBV|6
  • DGK|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7 Application and Implementation

Note:

Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes, as well as validating and testing their design implementation to confirm system functionality.