The OPA828 and OPA2828 (OPAx828) JFET input operational amplifiers are the next generation OPA627 and OPA827, combining high speed with high dc precision and ac performance. These op amps supply low offset voltage, low drift over temperature, low bias current, and low noise with only 60-nVRMS 0.1-Hz to 10-Hz noise. The OPAx828 operate over a wide supply-voltage range of ±4 V to ±18 V and a supply current of 5.5 mA/channel, typical.
AC characteristics, including a 45-MHz gain bandwidth product (GBW), a slew rate of 150 V/μs, and precision dc characteristics, make the OPAx828 family an excellent choice for a variety of systems. These include high-speed and high-resolution data-acquisition systems, such as 16-bit to 18-bit mixed signal systems, transimpedance (I/V-conversion) amplifiers, filters, precision ±10-V front ends, and high-impedance sensor-interface applications.
The OPAx828 are available in an 8-pin SOIC package and a thermally enhanced, 8-pin HVSSOP PowerPAD™ integrated circuit package.
PART NUMBER | CHANNELS | PACKAGE(1) |
---|---|---|
OPA828 | Single | D (SOIC, 8) |
DGN (HVSSOP, 8) | ||
OPA2828 | Dual | DGN (HVSSOP, 8) |
Changes from Revision C (December 2018) to Revision D (December 2022)
Changes from Revision B (December 2018) to Revision C (October 2022)
Changes from Revision A (November 2018) to Revision B (December 2018)
NAME | NO. | TYPE | DESCRIPTION |
---|---|---|---|
–IN | 2 | Input | Negative (inverting) input |
+IN | 3 | Input | Positive (noninverting) input |
NC | 1, 5, 8 | — | No internal connection (can be left floating or grounded) |
OUT | 6 | Output | Output |
V+ | 7 | — | Positive (highest) power supply |
V– | 4 | — | Negative (lowest) power supply |
Thermal Pad(1) | — | — | Exposed thermally conductive pad on the underside of the package. Solder the thermal pad to a heat-spreading power or ground plane. Although electrically isolated (> 10 MΩ) from the die, tie the thermal pad to V− or ground to minimize leakage to the input pins |
NAME | NO. | TYPE | DESCRIPTION |
---|---|---|---|
–IN A | 2 | Input | Negative (inverting) input A |
+IN A | 3 | Input | Positive (noninverting) input A |
–IN B | 6 | Input | Negative (inverting) input B |
+IN B | 5 | Input | Positive (noninverting) input B |
OUT A | 1 | Output | Output A |
OUT B | 7 | Output | Output B |
V+ | 8 | — | Positive (highest) power supply |
V– | 4 | — | Negative (lowest) power supply |
Thermal Pad(1) | — | — | Exposed thermally conductive pad on the underside of the package. Solder the thermal pad to a heat-spreading power or ground plane. Although electrically isolated (> 10 MΩ) from the die, tie the thermal pad to V− or ground to minimize leakage to the input pins |