SLOS713J January   2011  – March 2021 OPA2835 , OPA835

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparision Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information: OPA835
    5. 7.5 Thermal Information: OPA2835
    6. 7.6 Electrical Characteristics: VS = 2.7 V
    7. 7.7 Electrical Characteristics: VS = 5 V
    8. 7.8 Typical Characteristics: VS = 2.7 V
    9. 7.9 Typical Characteristics: VS = 5 V
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Input Common-Mode Voltage Range
      2. 8.3.2 Output Voltage Range
      3. 8.3.3 Power-Down Operation
      4. 8.3.4 Low-Power Applications and the Effects of Resistor Values on Bandwidth
      5. 8.3.5 Driving Capacitive Loads
    4. 8.4 Device Functional Modes
      1. 8.4.1 Split-Supply Operation (±1.25 V to ±2.75 V)
      2. 8.4.2 Single-Supply Operation (2.5 V to 5.5 V)
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1  Noninverting Amplifier
      2. 9.1.2  Inverting Amplifier
      3. 9.1.3  Instrumentation Amplifier
      4. 9.1.4  Attenuators
      5. 9.1.5  Single-Ended to Differential Amplifier
      6. 9.1.6  Differential to Single-Ended Amplifier
      7. 9.1.7  Differential-to-Differential Amplifier
      8. 9.1.8  Gain Setting With OPA835 RUN Integrated Resistors
      9. 9.1.9  Pulse Application With Single-Supply
      10. 9.1.10 ADC Driver Performance
    2. 9.2 Typical Application
      1. 9.2.1 Audio Frequency Performance
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curves
      2. 9.2.2 Active Filters
        1. 9.2.2.1 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Development Support
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Related Links
    4. 12.4 Receiving Notification of Documentation Updates
    5. 12.5 Support Resources
    6. 12.6 Trademarks
    7. 12.7 Electrostatic Discharge Caution
    8. 12.8 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.5 Thermal Information: OPA2835

THERMAL METRIC(1)OPA2835UNIT
D
(SOIC)		DGS
(VSSOP)		RUN
(QFN)		RMC
(UQFN)
8 PINS10 PINS10 PINS10 PINS
RθJAJunction-to-ambient thermal resistance150.1206145.8143.2°C/W
RθJCtopJunction-to-case (top) thermal resistance83.875.375.149.0°C/W
RθJBJunction-to-board thermal resistance68.496.238.961.9°C/W
ψJTJunction-to-top characterization parameter33.012.913.53.3°C/W
ψJBJunction-to-board characterization parameter67.994.6104.561.9°C/W
(1) For more information about traditional and new thermal metrics, see Semiconductor and IC Package Thermal Metrics (SPRA953).