SBOS622C July   2018  – January 2023 OPA855

PRODUCTION DATA  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Device Comparison Table
  6. Pin Configuration and Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Thermal Information
    4. 7.4 Recommended Operating Conditions
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. Parameter Measurement Information
  9. Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Input and ESD Protection
      2. 9.3.2 Feedback Pin
      3. 9.3.3 Wide Gain-Bandwidth Product
      4. 9.3.4 Slew Rate and Output Stage
    4. 9.4 Device Functional Modes
      1. 9.4.1 Split-Supply and Single-Supply Operation
      2. 9.4.2 Power-Down Mode
  10. 10Application, Implementation, and Layout
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
      3. 10.2.3 Application Curves
    3. 10.3 Typical Application
      1. 10.3.1 Design Requirements
      2. 10.3.2 Detailed Design Procedure
      3. 10.3.3 Application Curves
    4. 10.4 Power Supply Recommendations
    5. 10.5 Layout
      1. 10.5.1 Layout Guidelines
      2. 10.5.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Support Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Typical Characteristics

at TA = 25°C, VS+ = 2.5 V, VS– = –2.5 V, VIN+ = 0 V, RF = 453 Ω, Gain = 7 V/V, RL = 200 Ω, and output load referenced to midsupply (unless otherwise noted)

GUID-64EBC0B6-D2FE-4A2E-B6A0-7DF259449732-low.gif
VOUT = 100 mVPP; for circuit configuration, see Section 8
Figure 7-1 Small-Signal Frequency Response vs Gain
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VOUT = 100 mVPP
Figure 7-3 Small-Signal Frequency Response vs Output Load
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VOUT = 100 mVPP; for circuit configuration, see Figure 8-3
Figure 7-5 Small-Signal Frequency Response vs Capacitive Load
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VOUT = 2 VPP
Figure 7-7 Large-Signal Response for 0.1-dB Gain Flatness
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Small-Signal Response
Figure 7-9 Closed-Loop Output Impedance vs Frequency
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Figure 7-11 Voltage and Current Noise Density vs Frequency
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Figure 7-13 Harmonic Distortion (HD2) vs Output Swing
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VOUT = 2 VPP
Figure 7-15 Harmonic Distortion (HD2) vs Output Load
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VOUT = 2 VPP
Figure 7-17 Harmonic Distortion (HD2) vs Gain
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Average Rise and Fall Time (10% – 90%) = 300 ps
Rise and fall time limited by test equipment
Figure 7-19 Small-Signal Transient Response
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Figure 7-21 Small-Signal Transient Response vs Capacitive Load
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Figure 7-23 Turnon Transient Response
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Small-Signal Response
Figure 7-25 Common-Mode Rejection Ratio vs Frequency
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3 Typical Units
Figure 7-27 Quiescent Current vs Supply Voltage
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3 Typical Units
Figure 7-29 Offset Voltage vs Supply Voltage
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VS+ = 5 V, VS– = 0 V 3 Typical Units
Figure 7-31 Offset Voltage vs Input Common-Mode Voltage
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VS+ = 5 V, VS– = 0 V 3 Typical Units
Figure 7-33 Offset Voltage vs Output Swing
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3 Typical Units
Figure 7-35 Input Bias Current vs Ambient Temperature
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VS+ = 5 V, VS– = 0 V
Figure 7-37 Output Swing vs Sinking Current
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µ = 17.6 mA σ = 0.3 mA 13780 units tested
Figure 7-39 Quiescent Current Distribution
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µ = –11.2 µA σ = 0.6 µA 13780 units tested
Figure 7-41 Input Bias Current Distribution
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VOUT = 100 mVPP
Figure 7-2 Small-Signal Frequency Response vs Supply Voltage
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Gain = 39.2 V/V, RF = 953 Ω VOUT = 100 mVPP
Figure 7-4 Small-Signal Frequency Response vs Ambient Temperature
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VOUT = 2 VPP
Figure 7-6 Large-Signal Frequency Response vs Gain
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Figure 7-8 Large-Signal Frequency Response vs Voltage Supply
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Small-Signal Response
Figure 7-10 Open-Loop Magnitude and Phase vs Frequency
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Frequency = 10 MHz
Figure 7-12 Voltage Noise Density vs Ambient Temperature
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Figure 7-14 Harmonic Distortion (HD3) vs Output Swing
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VOUT = 2 VPP
Figure 7-16 Harmonic Distortion (HD3) vs Output Load
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VOUT = 2 VPP
Figure 7-18 Harmonic Distortion (HD3) vs Gain
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Average Rise and Fall Time (10% – 90%) = 569 ps
Figure 7-20 Large-Signal Transient Response
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2x Output Overdrive
Figure 7-22 Output Overload Response
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Figure 7-24 Turnoff Transient Response
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Small-Signal Response
Figure 7-26 Power Supply Rejection Ratio vs Frequency
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Figure 7-28 Quiescent Current vs Ambient Temperature
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µ = 0.4 µV/°C σ = 0.7 µV/°C 28 units tested
Figure 7-30 Offset Voltage vs Ambient Temperature
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VS+ = 5 V, VS– = 0 V
Figure 7-32 Offset Voltage vs Input Common-Mode Voltage vs Ambient Temperature
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VS+ = 5 V, VS– = 0 V
Figure 7-34 Offset Voltage vs Output Swing vs Ambient Temperature
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VS+ = 5 V, VS– = 0 V
Figure 7-36 Input Bias Current vs Input Common-Mode Voltage vs Ambient Temperature
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VS+ = 5 V, VS– = 0 V
Figure 7-38 Output Swing vs Sourcing Current
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µ = –0.2 mV σ = 0.15 mV 13780 units tested
Figure 7-40 Offset Voltage Distribution
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µ = 0.04 µA σ = 0.1 µA 13780 units tested
Figure 7-42 Input Offset Current Distribution