SBOS622C July   2018  – January 2023 OPA855

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Thermal Information
    4. 7.4 Recommended Operating Conditions
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Input and ESD Protection
      2. 9.3.2 Feedback Pin
      3. 9.3.3 Wide Gain-Bandwidth Product
      4. 9.3.4 Slew Rate and Output Stage
    4. 9.4 Device Functional Modes
      1. 9.4.1 Split-Supply and Single-Supply Operation
      2. 9.4.2 Power-Down Mode
  10. 10Application, Implementation, and Layout
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
      3. 10.2.3 Application Curves
    3. 10.3 Typical Application
      1. 10.3.1 Design Requirements
      2. 10.3.2 Detailed Design Procedure
      3. 10.3.3 Application Curves
    4. 10.4 Power Supply Recommendations
    5. 10.5 Layout
      1. 10.5.1 Layout Guidelines
      2. 10.5.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Support Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Pin Configuration and Functions

Figure 6-1 DSG Package,
8-Pin WSON With Exposed Thermal Pad
(Top View)
Figure 6-2 Bare Die Package (Preview)
Table 6-1 Pin Functions
PIN TYPE(1) DESCRIPTION
NAME NO.
FB 1 I Feedback connection to output of amplifier
IN– 3 I Inverting input
IN+ 4 I Noninverting input
NC 2 — Do not connect
OUT 6 O Amplifier output
PD 8 I Power down connection. PD = logic low = power off mode; PD = logic high = normal operation.
VS– 5 — Negative voltage supply
VS+ 7 — Positive voltage supply
Thermal pad — Connect the thermal pad to VS–
Table 6-2 Bond Pad Functions
PAD TYPE(1) DESCRIPTION
NAME NO.
FB 1 I Feedback connection to output of amplifier
IN– 3 I Inverting input
IN+ 4 I Noninverting input
NC 2,5,6,13 — Do not connect
OUT 9 O Amplifier output
PD 12 I Power down connection. PD = logic low = power off mode; PD = logic high = normal operation.
VS– 7,8 — Negative voltage supply
VS+ 10,11 — Positive voltage supply
Backside — Connect to VS–
(1) I = input, O = output, FB = feedback, NC = no connect