SBOS919C August   2019  – August 2020 OPA862

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics: VS = ±2.5 V to ±5 V
    6. 6.6 Typical Characteristics: VS = ±5 V
    7. 6.7 Typical Characteristics: VS = ±2.5 V
    8. 6.8 Typical Characteristics: VS = 1.9 V, –1.4 V
    9. 6.9 Typical Characteristics: VS = 1.9 V, –1.4 V to ±5 V
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Input and ESD Protection
      2. 7.3.2 Anti-Phase Reversal Protection
      3. 7.3.3 Precision and Low Noise
    4. 7.4 Device Functional Modes
      1. 7.4.1 Split-Supply Operation (±1.5 V to ±6.3 V)
      2. 7.4.2 Single-Supply Operation (3 V to 12.6 V)
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Single-Ended-to-Differential Gain of 4 V/V
    2. 8.2 Typical Applications
      1. 8.2.1 Single-Ended to Differential with 2.5-V Output Common-Mode Voltage
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Transimpedance Amplifier Configuration
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
        3. 8.2.2.3 Application Curves
      3. 8.2.3 DC Level-Shifting
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Examples
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5 Pin Configuration and Functions

GUID-D72DE7A3-D222-4700-B1B2-ECF1D3477F0D-low.gifFigure 5-1 D Package,8-Pin SOIC (Top View)
GUID-08B52F73-FB93-4DDF-9D3C-A2F4D1529A2D-low.gifFigure 5-2 DTK Package,8-Pin WSON(Top View)
Table 5-1 Pin Functions
PIN(1) TYPE(2) DESCRIPTION
NAME NO.
PD 7 I Power down (low = enable, high = disable), cannot be floated
VFB 1 I Amplifier 1 inverting (feedback) input
VIN 8 I Amplifier 1 noninverting (signal) input
VOUT+ 4 O Noninverting output
VOUT– 5 O Inverting output
VREF 2 I Amplifier 2 noninverting (reference) input
VS+ 3 P Positive power supply
VS– 6 P Negative power supply
(1) Solder the exposed DTK package thermal pad to a heatspreading power or ground plane. This pad is electrically isolated from the die, but must be connected to a power or ground plane and not floated.
(2) I = input, O = output, and P = power.