SBOS933I
February 2019 – August 2021
OPA2990
,
OPA4990
,
OPA990
PRODUCTION DATA
1
Features
2
Applications
3
Description
4
Revision History
5
Pin Configuration and Functions
6
Specifications
6.1
Absolute Maximum Ratings
6.2
ESD Ratings
6.3
Recommended Operating Conditions
6.4
Thermal Information for Single Channel
6.5
Thermal Information for Dual Channel
6.6
Thermal Information for Quad Channel
6.7
Electrical Characteristics
6.8
Typical Characteristics
7
Detailed Description
7.1
Overview
7.2
Functional Block Diagram
7.3
Feature Description
7.3.1
Input Protection Circuitry
7.3.2
EMI Rejection
7.3.3
Thermal Protection
7.3.4
Capacitive Load and Stability
7.3.5
Common-Mode Voltage Range
7.3.6
Phase Reversal Protection
7.3.7
Electrical Overstress
7.3.8
Overload Recovery
7.3.9
Typical Specifications and Distributions
7.3.10
Packages With an Exposed Thermal Pad
7.3.11
Shutdown
7.4
Device Functional Modes
8
Application and Implementation
8.1
Application Information
8.2
Typical Applications
8.2.1
High Voltage Buffered Multiplexer
8.2.2
Slew Rate Limit for Input Protection
9
Power Supply Recommendations
10
Layout
10.1
Layout Guidelines
10.2
Layout Example
11
Device and Documentation Support
11.1
Device Support
11.1.1
Development Support
11.1.1.1
TINA-TI (Free Software Download)
11.2
Documentation Support
11.2.1
Related Documentation
11.3
Receiving Notification of Documentation Updates
11.4
Support Resources
11.5
Trademarks
11.6
Electrostatic Discharge Caution
11.7
Glossary
12
Mechanical, Packaging, and Orderable Information
Package Options
Mechanical Data (Package|Pins)
DCK|5
MPDS025J
DBV|5
MPDS018T
DBV|6
MPDS026Q
Thermal pad, mechanical data (Package|Pins)
Orderable Information
sbos933i_oa
sbos933i_pm
11.7
Glossary
TI Glossary
This glossary lists and explains terms, acronyms, and definitions.