SBOS933I February   2019  – August 2021 OPA2990 , OPA4990 , OPA990

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information for Single Channel
    5. 6.5 Thermal Information for Dual Channel
    6. 6.6 Thermal Information for Quad Channel
    7. 6.7 Electrical Characteristics
    8. 6.8 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Input Protection Circuitry
      2. 7.3.2  EMI Rejection
      3. 7.3.3  Thermal Protection
      4. 7.3.4  Capacitive Load and Stability
      5. 7.3.5  Common-Mode Voltage Range
      6. 7.3.6  Phase Reversal Protection
      7. 7.3.7  Electrical Overstress
      8. 7.3.8  Overload Recovery
      9. 7.3.9  Typical Specifications and Distributions
      10. 7.3.10 Packages With an Exposed Thermal Pad
      11. 7.3.11 Shutdown
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 High Voltage Buffered Multiplexer
      2. 8.2.2 Slew Rate Limit for Input Protection
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
        1. 11.1.1.1 TINA-TI (Free Software Download)
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Support Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from Revision H (May 2021) to Revision I (August 2021)

  • Removed preview notation from OPA2990 VSSOP-8 package (DGK) from Device Information tableGo
  • Removed preview notation from OPA2990 VSSOP-8 package (DGK) in the Pin Configuration and Functions sectionGo
  • Added note explaining difference between DDF and TDDF packages in the Pin Configuration and Functions sectionGo
  • Corrected typo describing shutdown region in Recommended Operating Conditions to match rest of data sheetGo
  • Changed Junction-to-ambient thermal resistance value for SOT-23-6 (DBV-6) from 1174.5ºC/W to 174.5ºC/W in the Thermal Information for Single Channel section.Go
  • Added clarifying statement regarding logic low signal for SHDN pin in the Shutdown sectionGo
  • Corrected statement on shutdown enable and disable times in the Shutdown section from 30 µs and 3 µs to 11 µs and 2.5 µs, respectively, to match the Electrical Characteristics sectionGo

Changes from Revision G (December 2020) to Revision H (May 2021)

  • Removed preview notation from OPA4990 WQFN (16) package from Device Information tableGo
  • Removed preview notation from OPA4990 X2QFN (14) package from Device Information tableGo
  • Removed preview notation from OPA4990 and OPA4990S RTE package (WQFN) in the Pin Configuration and Functions sectionGo
  • Removed Table of Graphs from Specifications sectionGo
  • Clarified threshold and maximum voltage levels of the shutdown pin in the Shutdown sectionGo
  • Removed Related Links from Device and Documentation sectionGo

Changes from Revision F (May 2020) to Revision G (December 2020)

  • Updated the numbering format for tables, figures and cross-references throughout the document Go
  • Removed preview notation from OPA2990 SOT-23 (8) package from Device Information tableGo
  • Added OPA2990 VSSOP (10) package to Device Information tableGo
  • Clarified SHDN notation on OPA990S Pin Functions Go
  • Removed preview notation from OPA2990 DDF package (SOT-23) in the Pin Configuration and Functions sectionGo
  • Removed preview notation from OPA2990S DGS package (VSSOP) in the Pin Configuration and Functions section Go
  • Clarified SHDN notation for OPA2990S in the Pin Functions section Go
  • Clarified SHDN notation for OPA4990S in the Pin Functions section Go

Changes from Revision E (December 2019) to Revision F (May 2020)

  • Removed preview notation from OPA2990 X2QFN (10) package from Device Information table Go
  • Removed preview notation from OPA2990S RUG package (X2QFN) in the Pin Configuration and Functions section Go
  • Changed RUG (X2QFN) in Thermal Information for Dual Channel sectionGo

Changes from Revision D (July 2019) to Revision E (December 2019)

  • Changed the OPA990 and OPA4990 device statuses from Advance Information to Production Data Go
  • Removed preview notation from OPA990 SOT-23 (5) package from Device Information tableGo
  • Removed preview notation from OPA990S SOT-23 (6) package from Device Information tableGo
  • Removed preview notation from OPA990 SC70 (5) package from Device Information tableGo
  • Removed preview notation from OPA4990 SOIC (14) package from Device Information tableGo
  • Removed preview notation from OPA4990 TSSOP (14) package from Device Information tableGo
  • Removed preview notation from OPA990 DBV package (SOT-23) in the Pin Configuration and Functions sectionGo
  • Removed preview notation from OPA990 DCK package (SC70) in the Pin Configuration and Functions sectionGo
  • Removed preview notation from OPA4990 D (SOIC) and TSSOP (PW) packages in the Pin Configuration and Functions sectionGo
  • Removed preview notation from OPA990S DBV package (SOT-23) in the Pin Configuration and Functions sectionGo

Changes from Revision C (May 2019) to Revision D (July 2019)

  • Removed preview notation from OPA2990 WSON (8) package from Device Information tableGo
  • Removed preview notation from OPA2990 DSG package (WSON) in the Pin Configuration and Functions sectionGo
  • Added SHUTDOWN to Electrical Characteristics tableGo
  • Added Shutdown section to the Detailed Description sectionGo

Changes from Revision B (April 2019) to Revision C (May 2019)

  • Removed preview notation from OPA2990 TSSOP (8) package from Device Information tableGo
  • Removed preview notation from OPA2990 PW package (TSSOP) in the Pin Configuration and Functions sectionGo

Changes from Revision A (March 2019) to Revision B (April 2019)

  • Removed preview notation from OPA2990 SOIC (8) package from Device Information tableGo
  • Removed preview notation from OPA2990 D package (SOIC) in the Pin Configuration and Functions sectionGo

Changes from Revision * (February 2019) to Revision A (March 2019)

  • Changed the OPA2990 device status from Advance Information to Production Data Go