SBOSA12H March 2020 – March 2024 OPA2991-Q1 , OPA4991-Q1 , OPA991-Q1
PRODUCTION DATA
THERMAL METRIC (1) | OPA4991-Q1 | UNIT | |||
---|---|---|---|---|---|
D (SOIC) |
PW (TSSOP) |
DYY (SOT-23) |
|||
14 PINS | 14 PINS | 14 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 101.4 | 118.0 | 110.7 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 57.6 | 47.6 | 55.9 | °C/W |
RθJB | Junction-to-board thermal resistance | 57.3 | 60.9 | 35.3 | °C/W |
ψJT | Junction-to-top characterization parameter | 18.5 | 6.0 | 2.3 | °C/W |
ψJB | Junction-to-board characterization parameter | 56.9 | 60.4 | 35.1 | °C/W |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | N/A | N/A | °C/W |