SBOSA12H March   2020  – March 2024 OPA2991-Q1 , OPA4991-Q1 , OPA991-Q1

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information for Single Channel
    5. 5.5 Thermal Information for Dual Channel
    6. 5.6 Thermal Information for Quad Channel
    7. 5.7 Electrical Characteristics
    8. 5.8 Typical Characteristics
  7. Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1  Input Protection Circuitry
      2. 6.3.2  EMI Rejection
      3. 6.3.3  Thermal Protection
      4. 6.3.4  Capacitive Load and Stability
      5. 6.3.5  Common-Mode Voltage Range
      6. 6.3.6  Phase Reversal Protection
      7. 6.3.7  Electrical Overstress
      8. 6.3.8  Overload Recovery
      9. 6.3.9  Typical Specifications and Distributions
      10. 6.3.10 Shutdown
    4. 6.4 Device Functional Modes
  8. Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Applications
      1. 7.2.1 Low-Side Current Measurement
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
        3. 7.2.1.3 Application Curve
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Development Support
        1. 8.1.1.1 TINA-TI (Free Software Download)
        2. 8.1.1.2 TI Precision Designs
    2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation
    3. 8.3 Receiving Notification of Documentation Updates
    4. 8.4 Support Resources
    5. 8.5 Trademarks
    6. 8.6 Electrostatic Discharge Caution
    7. 8.7 Glossary
  10. Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Electrical Characteristics

For VS = (V+) – (V–) = 2.7 V to 40 V (±1.35 V to ±20 V) at TA = 25°C, RL = 10 kΩ connected to VS / 2, VCM = VS / 2, and
VOUT = VS / 2, unless otherwise noted.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
OFFSET VOLTAGE
VOS Input offset voltage VCM = V– ±125 ±895 µV
TA = –40°C to 125°C ±925
dVOS/dT Input offset voltage drift TA = –40°C to 125°C ±0.3 µV/℃
PSRR Input offset voltage versus power supply VCM = V–, VS = 4 V to 40 V TA = –40°C to 125°C ±0.3 ±1 µV/V
VCM = V–, VS = 2.7 V to 40 V(3) ±1 ±5
Channel separation f = 0 Hz 5 µV/V
INPUT BIAS CURRENT
IB Input bias current ±10 pA
IOS Input offset current ±10 pA
NOISE
EN Input voltage noise f = 0.1 Hz to 10 Hz   1.8 µVPP
  0.3   µVRMS
eN Input voltage noise density f = 1 kHz 10.8   nV/√Hz
f = 10 kHz   9.4  
iN Input current noise f = 1 kHz   82   fA/√Hz
INPUT VOLTAGE RANGE
VCM Common-mode voltage range (V–) – 0.1 (V+) + 0.1 V
CMRR Common-mode rejection ratio VS = 40 V, (V–) – 0.1 V < VCM < (V+) – 2 V (Main input pair) TA = –40°C to 125°C 107 130 dB
VS = 4 V, (V–) – 0.1 V < VCM < (V+) – 2 V (Main input pair) 82 100
VS = 2.7 V, (V–) – 0.1 V < VCM < (V+) – 2 V (Main input pair)(3) 75 95
VS = 2.7 V to 40 V, (V+) – 1 V < VCM < (V+) + 0.1 V (Aux input pair) 85
INPUT CAPACITANCE
ZID Differential 100 || 9 MΩ || pF
ZICM Common-mode 6 || 1 TΩ || pF
OPEN-LOOP GAIN
AOL Open-loop voltage gain VS = 40 V, VCM = V–
(V–) + 0.1 V < VO < (V+) –  0.1 V
120 145 dB
TA = –40°C to 125°C 142
VS = 4 V, VCM = V–
(V–) + 0.1 V < VO < (V+) –  0.1 V
104 130
TA = –40°C to 125°C 125
VS = 2.7 V, VCM = V–
(V–) + 0.1 V < VO < (V+) –  0.1 V(3)
101 120
TA = –40°C to 125°C 118
FREQUENCY RESPONSE
GBW Gain-bandwidth product 4.5 MHz
SR Slew rate VS = 40 V, G = +1, CL = 20 pF 21 V/µs
tS Settling time To 0.01%, VS = 40 V, VSTEP = 10 V , G = +1, CL = 20 pF 2.5 µs
To 0.01%, VS = 40 V, VSTEP = 2 V , G = +1, CL = 20 pF 1.5
To 0.1%, VS = 40 V, VSTEP = 10 V , G = +1, CL = 20 pF 2
To 0.1%, VS = 40 V, VSTEP = 2 V , G = +1, CL = 20 pF 1
Phase margin G = +1, RL = 10 kΩ, CL = 20 pF 60 °
Overload recovery time VIN  × gain > VS 400 ns
THD+N Total harmonic distortion + noise (1) VS = 40 V, VO = 3 VRMS, G = 1, f = 1 kHz 0.00021%
OUTPUT
  Voltage output swing from rail Positive and negative rail headroom VS = 40 V, RL = no load(3)   5 10 mV
VS = 40 V, RL = 10 kΩ   50 55
VS = 40 V, RL = 2 kΩ   200 250
VS = 2.7 V, RL = no load(3)   1 6
VS = 2.7 V, RL = 10 kΩ   5 12
VS = 2.7 V, RL = 2 kΩ   25 40
ISC Short-circuit current ±75 mA
CLOAD Capacitive load drive 1000
pF
ZO Open-loop output impedance f = 1 MHz, IO = 0 A 525
POWER SUPPLY
IQ Quiescent current per amplifier VCM = V–, IO = 0 A 560 685 µA
VCM = V–, IO = 0 A, (OPA991-Q1) 560 691
VCM = V–, IO = 0 A TA = –40°C to 125°C 750
VCM = V–, IO = 0 A, (OPA991-Q1) 769
SHUTDOWN
IQSD Quiescent current per amplifier VS = 2.7 V to 40 V, all amplifiers disabled, SHDN = V– + 2 V 30 45 µA
ZSHDN Output impedance during shutdown VS = 2.7 V to 40 V, amplifier disabled, SHDN = V- + 2V 320 || 2 MΩ || pF
VIH Logic high threshold voltage (amplifier disabled) For valid input high, the SHDN pin voltage should be greater than the maximum threshold but less than or equal to (V–) + 20 V (V–) + 0.8 (V–) + 1.1 V
VIL Logic low threshold voltage (amplifier enabled) For valid input low, the SHDN pin voltage should be less than the minimum threshold but greater than or equal to V– (V–) + 0.2 (V–) + 0.8 V
tON Amplifier enable time (full shutdown) (2) G = +1, VCM = V-, VO = 0.1 × VS/2 G = +1, VCM = V-, VO = 0.1 × VS/2 8 µs
tOFF Amplifier disable time (2) VCM = V-, VO = VS/2 3 µs
SHDN pin input bias current (per pin) VS = 2.7 V to 40 V, (V-) +20 V ≥ SHDN ≥ (V–) + 0.9 V 500 nA
VS = 2.7 V to 40 V, (V–) ≤ SHDN ≤ (V–) + 0.7 V 150
Third-order filter; bandwidth = 80 kHz at –3 dB.
Disable time (tOFF) and enable time (tON) are defined as the time interval between the 50% point of the signal applied to the SHDN pin and the point at which the output voltage reaches the 10% (disable) or 90% (enable) level.
Specified by characterization only.