SBOSAC9E August   2022  – July 2024 OPA2992-Q1 , OPA4992-Q1 , OPA992-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information for Single Channel
    5. 5.5 Thermal Information for Dual Channel
    6. 5.6 Thermal Information for Quad Channel
    7. 5.7 Electrical Characteristics
    8. 5.8 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Input Protection Circuitry
      2. 6.3.2 EMI Rejection
      3. 6.3.3 Thermal Protection
      4. 6.3.4 Capacitive Load and Stability
      5. 6.3.5 Common-Mode Voltage Range
      6. 6.3.6 Phase Reversal Protection
      7. 6.3.7 Electrical Overstress
      8. 6.3.8 Overload Recovery
      9. 6.3.9 Typical Specifications and Distributions
    4. 6.4 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Applications
      1. 7.2.1 Low-Side Current Measurement
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
        3. 7.2.1.3 Application Curve
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Development Support
        1. 8.1.1.1 TINA-TI (Free Software Download)
    2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation
    3. 8.3 Receiving Notification of Documentation Updates
    4. 8.4 Support Resources
    5. 8.5 Trademarks
    6. 8.6 Electrostatic Discharge Caution
    7. 8.7 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9 Revision History

Changes from Revision D (April 2023) to Revision E (July 2024)

  • Added the 8-pin TSSOP (PW) package to the Package Information tableGo
  • Added 8-pin TSSOP (PW) package to the Pin Configurations and Functions sectionGo
  • Added 8-pin TSSOP (PW) package to Thermal Information for Dual Channel tableGo

Changes from Revision C (February 2023) to Revision D (April 2023)

  • Changed the status of the 14-pin SOIC (D) and TSSOP (PW) packages from: Preview to: Active Go

Changes from Revision B (January 2023) to Revision C (February 2023)

  • Changed the status of the 5-pin SOT-23 and 8-pin SOIC package from: Preview to: Active Go

Changes from Revision A (December 2022) to Revision B (January 2023)

  • Deleted the preview tag for the SC70-5 (DCK) packageGo

Changes from Revision * (August 2022) to Revision A (December 2022)

  • Changed the device status from Advance Information to ProdMix Go
  • Deleted the preview tag for the VSSOP-8 (DGK) packageGo