SBOSAF2D June   2023  – November 2024 OPA2994 , OPA994

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information for Single Channel
    5. 5.5 Thermal Information for Dual Channel
    6. 5.6 Electrical Characteristics
    7. 5.7 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Unlimited Capacitive Load Drive
      2. 6.3.2 Common-Mode Voltage Range
      3. 6.3.3 Phase Reversal Protection
      4. 6.3.4 Electrical Overstress
      5. 6.3.5 Overload Recovery
      6. 6.3.6 Typical Specifications and Distributions
    4. 6.4 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Applications
      1. 7.2.1 Low-Side Current Measurement
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
        3. 7.2.1.3 Application Curve
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Development Support
        1. 8.1.1.1 TINA-TI (Free Software Download)
    2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation
    3. 8.3 Receiving Notification of Documentation Updates
    4. 8.4 Support Resources
    5. 8.5 Trademarks
    6. 8.6 Electrostatic Discharge Caution
    7. 8.7 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|8
  • DBV|5
  • DCK|5
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9 Revision History

Changes from Revision C (September 2024) to Revision D (November 2024)

  • Added OPA2994IDDFR (SOT-23-8) throughout the data sheet in active statusGo

Changes from Revision B (March 2024) to Revision C (September 2024)

  • Changed the status of OPA994IDBVR (SOT-23-5) and OPA994IDCKR (SC70-5) from: preview to: active Go

Changes from Revision A (November 2023) to Revision B (March 2024)

  • Changed the slew rate in the Description section from: 18V/μs to: 35V/μsGo
  • Changed the status of OPA2994IDGKR from: preview to: active Go
  • Changed Human Body Model (HBM) ESD rating from 2.5kV to 4kVGo
  • Added the DGK (VSSOP) thermal values to the Thermal Information for Dual Channel tableGo

Changes from Revision * (June 2023) to Revision A (November 2023)

  • Updated the maximum supply voltage from 24V to 32V throughout data sheetGo
  • Changed the status of OPA2994IDR from: preview to: active Go
  • Added SOIC-8 package information for OPA994Go
  • Added device typical characteristic curves in Typical Characteristics sectionGo