SBOS929A December   2018  – December 2021 OPT3004

PRODMIX  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Revision History
  6. Description (continued)
  7. Pin Configuration and Functions
  8. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Typical Characteristics
  9. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Human Eye Matching
      2. 8.3.2 Automatic Full-Scale Range Setting
      3. 8.3.3 Interrupt Operation, INT Pin, and Interrupt Reporting Mechanisms
      4. 8.3.4 I2C Bus Overview
        1. 8.3.4.1 Serial Bus Address
        2. 8.3.4.2 Serial Interface
    4. 8.4 Device Functional Modes
      1. 8.4.1 Automatic Full-Scale Setting Mode
      2. 8.4.2 Interrupt Reporting Mechanism Modes
        1. 8.4.2.1 Latched Window-Style Comparison Mode
        2. 8.4.2.2 Transparent Hysteresis-Style Comparison Mode
        3. 8.4.2.3 End-of-Conversion Mode
        4. 8.4.2.4 End-of-Conversion and Transparent Hysteresis-Style Comparison Mode
    5. 8.5 Programming
      1. 8.5.1 Writing and Reading
        1. 8.5.1.1 High-Speed I2C Mode
        2. 8.5.1.2 General-Call Reset Command
        3. 8.5.1.3 SMBus Alert Response
    6. 8.6 Register Maps
      1. 8.6.1 Internal Registers
      2. 8.6.2 Register Descriptions
        1. 8.6.2.1 Result Register (offset = 00h)
        2. 8.6.2.2 Configuration Register (offset = 01h) [reset = C810h]
        3. 8.6.2.3 Low-Limit Register (offset = 02h) [reset = C0000h]
        4. 8.6.2.4 High-Limit Register (offset = 03h) [reset = BFFFh]
        5. 8.6.2.5 Manufacturer ID Register (offset = 7Eh) [reset = 5449h]
        6. 8.6.2.6 Device ID Register (offset = 7Fh) [reset = 3001h]
  10. Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Electrical Interface
      2. 9.1.2 Optical Interface
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Optomechanical Design
        2. 9.2.2.2 Dark Window Selection and Compensation
      3. 9.2.3 Application Curves
    3. 9.3 Do's and Don'ts
  11. 10Power-Supply Recommendations
  12. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
    3. 11.3 Soldering and Handling Recommendations
    4. 11.4 DNP (S-PDSO-N6) Mechanical Drawings
    5. 11.5 DTS (SOT-5X3) Mechanical Drawings
  13. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  14. 13Mechanical, Packaging, and Orderable Information
    1. 13.1 Tape and Reel Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Optomechanical Design

After completing the electrical design, the next task is the optomechanical design. Design a product case that includes a window to transmit the light from outside the product to the sensor, as shown in Figure 9-2. Design the window width and window height to give a ±45° field of view. A rigorous design of the field of view takes into account the location of the sensor area, as shown in Figure 9-2. The OPT3004 active sensor area is centered along one axis of the package top view, but has a minor offset on the other axis of the top view. Window sizing and placement is discussed in more rigorous detail in OPT3001: Ambient Light Sensor Application Guide.

OPT3004 Product Case and Window Over the OPT3004Figure 9-2 Product Case and Window Over the OPT3004