SBOSAC5 December   2022 OPT3005

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description (continued)
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Human Eye Matching
      2. 8.3.2 Automatic Full-Scale Range Setting
      3. 8.3.3 Interrupt Operation, INT Pin, and Interrupt Reporting Mechanisms
      4. 8.3.4 I2C Bus Overview
        1. 8.3.4.1 Serial Bus Address
        2. 8.3.4.2 Serial Interface
    4. 8.4 Device Functional Modes
      1. 8.4.1 Automatic Full-Scale Setting Mode
      2. 8.4.2 Interrupt Reporting Mechanism Modes
        1. 8.4.2.1 Latched Window-Style Comparison Mode
        2. 8.4.2.2 Transparent Hysteresis-Style Comparison Mode
        3. 8.4.2.3 End-of-Conversion Mode
        4. 8.4.2.4 End-of-Conversion and Transparent Hysteresis-Style Comparison Mode
    5. 8.5 Programming
      1. 8.5.1 Writing and Reading
        1. 8.5.1.1 High-Speed I2C Mode
        2. 8.5.1.2 General-Call Reset Command
        3. 8.5.1.3 SMBus Alert Response
    6. 8.6 Register Maps
      1. 8.6.1 Internal Registers
        1. 8.6.1.1 Register Descriptions
          1. 8.6.1.1.1 Result Register (offset = 00h)
          2. 8.6.1.1.2 Configuration Register (offset = 01h) [reset = C810h]
          3. 8.6.1.1.3 Low-Limit Register (offset = 02h) [reset = C0000h]
          4. 8.6.1.1.4 High-Limit Register (offset = 03h) [reset = BFFFh]
          5. 8.6.1.1.5 Manufacturer ID Register (offset = 7Eh) [reset = 5449h]
          6. 8.6.1.1.6 Device ID Register (offset = 7Fh) [reset = 3001h]
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Electrical Interface
      2. 9.1.2 Optical Interface
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Optomechanical Design
        2. 9.2.2.2 Dark Window Selection and Compensation
      3. 9.2.3 Application Curves
    3. 9.3 Do's and Don'ts
    4. 9.4 Power-Supply Recommendations
    5. 9.5 Layout
      1. 9.5.1 Layout Guidelines
      2. 9.5.2 Layout Example
      3. 9.5.3 Soldering and Handling Recommendations
      4. 9.5.4 Mechanical Drawings
  10. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  11. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.4 Thermal Information

THERMAL METRIC(1) OPT3005 UNIT
DTS (SOT)
8 Pins
RθJA Junction-to-ambient thermal resistance 112.2 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 28.4 °C/W
RθJB Junction-to-board thermal resistance 22.1 °C/W
ΨJT Junction-to-top characterization parameter 1.2 °C/W
ΨJB Junction-to-board characterization parameter 22 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.