SBOS698 October   2016 OPT3006

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Human Eye Matching
      2. 7.3.2 Automatic Full-Scale Range Setting
      3. 7.3.3 Interrupt Operation, INT Pin, and Interrupt Reporting Mechanisms
      4. 7.3.4 I2C Bus Overview
        1. 7.3.4.1 Serial Bus Address
        2. 7.3.4.2 Serial Interface
    4. 7.4 Device Functional Modes
      1. 7.4.1 Automatic Full-Scale Setting Mode
      2. 7.4.2 Interrupt Reporting Mechanism Modes
        1. 7.4.2.1 Latched Window-Style Comparison Mode
        2. 7.4.2.2 Transparent Hysteresis-Style Comparison Mode
        3. 7.4.2.3 End-of-Conversion Mode
        4. 7.4.2.4 End-of-Conversion and Transparent Hysteresis-Style Comparison Mode
    5. 7.5 Programming
      1. 7.5.1 Writing and Reading
        1. 7.5.1.1 High-Speed I2C Mode
        2. 7.5.1.2 General-Call Reset Command
        3. 7.5.1.3 SMBus Alert Response
    6. 7.6 Register Maps
      1. 7.6.1 Internal Registers
        1. 7.6.1.1 Register Descriptions
          1. 7.6.1.1.1 Result Register (offset = 00h)
          2. 7.6.1.1.2 Configuration Register (offset = 01h) [reset = C810h]
          3. 7.6.1.1.3 Low-Limit Register (offset = 02h) [reset = C0000h]
          4. 7.6.1.1.4 High-Limit Register (offset = 03h) [reset = BFFFh]
          5. 7.6.1.1.5 Manufacturer ID Register (offset = 7Eh) [reset = 5449h]
          6. 7.6.1.1.6 Device ID Register (offset = 7Fh) [reset = 3001h]
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Electrical Interface
      2. 8.1.2 Optical Interface
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Optomechanical Design
      3. 8.2.3 Application Curves
    3. 8.3 Do's and Don'ts
  9. 9 Power-Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Soldering and Handling Recommendations
      1. 10.2.1 Solder Paste
      2. 10.2.2 Package Placement
      3. 10.2.3 Reflow Profile
      4. 10.2.4 Special Flexible Printed Circuit Board (FPCB) Recommendations
      5. 10.2.5 Rework Process
    3. 10.3 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9 Power-Supply Recommendations

Although the OPT3006 has low sensitivity to power-supply issues, good practices are always recommended. For best performance, the OPT3006 VDD pin must have a stable, low-noise power supply with a 100-nF bypass capacitor close to the device, and solid grounding. There are many options for powering the OPT3006 because the device current consumption levels are very low.