SBOSA93C May   2023  – June 2024 OPT4001-Q1

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements
    7. 5.7 Timing Diagram
    8. 5.8 Typical Characteristics
  7. Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Spectral Matching to Human Eye
      2. 6.3.2 Automatic Full-Scale Range Setting
      3. 6.3.3 Error Correction Code (ECC) Features
        1. 6.3.3.1 Output Sample Counter
        2. 6.3.3.2 Output CRC
      4. 6.3.4 Output Register FIFO
      5. 6.3.5 Threshold Detection
    4. 6.4 Device Functional Modes
      1. 6.4.1 Modes of Operation
      2. 6.4.2 Interrupt Modes of Operation
      3. 6.4.3 Light Range Selection
      4. 6.4.4 Selecting Conversion Time
      5. 6.4.5 Light Measurement in Lux
      6. 6.4.6 Threshold Detection Calculations
      7. 6.4.7 Light Resolution
    5. 6.5 Programming
      1. 6.5.1 I2C Bus Overview
        1. 6.5.1.1 Serial Bus Address
        2. 6.5.1.2 Serial Interface
      2. 6.5.2 Writing and Reading
        1. 6.5.2.1 High-Speed I2C Mode
        2. 6.5.2.2 Burst Read Mode
        3. 6.5.2.3 General-Call Reset Command
        4. 6.5.2.4 SMBus Alert Response (USON Variant)
  8. Register Maps
    1. 7.1 Register Descriptions
  9. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Electrical Interface
        1. 8.2.1.1 Design Requirements
          1. 8.2.1.1.1 Optical Interface
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Optomechanical Design (PicoStar Variant)
          2. 8.2.1.2.2 Optomechanical Design (USON Variant)
        3. 8.2.1.3 Application Curves (PicoStar Variant)
        4. 8.2.1.4 Application Curves (USON Variant)
    3. 8.3 Best Design Practices
    4. 8.4 Power Supply Recommendations
    5. 8.5 Layout
      1. 8.5.1 Layout Guidelines
        1. 8.5.1.1 Soldering and Handling Recommendations (PicoStar Variant)
          1. 8.5.1.1.1 Solder Paste
          2. 8.5.1.1.2 Package Placement
          3. 8.5.1.1.3 Reflow Profile
          4. 8.5.1.1.4 Special Flexible Printed-Circuit Board (FPCB) Recommendations
          5. 8.5.1.1.5 Rework Process
        2. 8.5.1.2 Soldering and Handling Recommendations (USON Variant)
      2. 8.5.2 Layout Example
  10. Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DNP|6
  • YMN|4
Thermal pad, mechanical data (Package|Pins)
Orderable Information
Optical Interface

Figure 8-3 shows the dimensions of the optical area.

The optical interface is physically located on the same side of the device pins as the electrical interface for the PicoStar™ variant and facing away from the pins for the USON variant, as shown in Figure 8-2 and Figure 8-3.

OPT4001-Q1 PicoStar™ Sensor
                    Position Figure 8-2 PicoStar™ Sensor Position
OPT4001-Q1 USON Sensor PositionFigure 8-3 USON Sensor Position

In case of the PicoStar™ variant systems, light that illuminates the sensor must come through the FPCB. Typically, the best method is to create a cutout area in the FPCB. Other methods are possible, but with associated design tradeoffs. This cutout must be carefully designed because the dimensions and tolerances impact the net-system, optical field-of-view performance. The design of this cutout is discussed more in Section 8.5.2.

Generally, any physical component that affects the light illuminating the sensing area of a light sensor also affects the performance of that light sensor. For example, a dark or opaque window can be used to further enhance the visual appeal of the design by hiding the sensor from view. This window material is typically transparent plastic or glass. Therefore, for the best performance, make sure to understand and control the effect of these components. Design a window width and height to permit light from a sufficient field of view to illuminate the sensor. For best performance, use a field of view of at least ±35°, or preferably ±45° or more. Understanding and designing the field of view is discussed further in the OPT3001: Ambient Light Sensor Application Guide application note.

The visible-spectrum transmission for dark windows typically ranges between 5% to 30%, but can be less than 1%. Specify a visible-spectrum transmission as low as, but no more than, necessary to achieve sufficient visual appeal because decreased transmission decreases the available light for the sensor to measure. The windows are made dark by either applying an ink to a transparent window material, or including a dye or other optical substance within the window material. This attenuating transmission in the visible spectrum of the window creates a ratio between the light on the outside of the design and the light that is measured by the device. To accurately measure the light outside of the design, compensate the device measurement for this ratio.

Although the inks and dyes of dark windows serve a primary purpose of being minimally transmissive to visible light, some inks and dyes can also be very transmissive to infrared light. The use of these inks and dyes further decreases the ratio of visible to infrared light, and thus decreases sensor measurement accuracy. However, because of the excellent red and infrared rejection of the device, this effect is minimized, and good results are achieved under a dark window with similar spectral responses.

For best accuracy, avoid grill-like window structures, unless the designer understands the optical effects sufficiently. These grill-like window structures create a nonuniform illumination pattern on the sensor that causes light measurement results to vary with placement tolerances and the angle of incidence of the light. If a grill-like structure is desired, then this device is an excellent sensor choice because the device is minimally sensitive to illumination uniformity issues disrupting the measurement process.

Light pipes can appear attractive for aiding in the optomechanical design that brings light to the sensor; however, do not use light pipes with any light sensor unless the system designer fully understands the ramifications of the optical physics of light pipes within the full context of the design and objectives.