SBOSA93C May 2023 – June 2024 OPT4001-Q1
PRODUCTION DATA
Refer to the PDF data sheet for device specific package drawings
For solder-paste deposition, use a stencil-printing process that involves the transfer of solder paste through predefined apertures with the application of pressure. Stencil parameters, such as aperture area ratio and fabrication process, have a significant impact on paste deposition. Cut the stencil apertures using a laser with an electropolish-fabrication method. Taper the stencil aperture walls by 5° to facilitate paste release. Shifting the solder-paste towards the outside of the device minimizes the possibility of solder getting into the device sensing area. See the mechanical packages attached to the end of this data sheet.
Use solder paste selection type 4 or higher, no-clean, lead-free solder paste. If solder splatters in the reflow process, choose a solder paste with normal- or low-flux contents, or alter the reflow profile per the Section 8.5.1.1.3.