SBOSA93C May 2023 – June 2024 OPT4001-Q1
PRODUCTION DATA
Refer to the PDF data sheet for device specific package drawings
Use a pick-and-place nozzle with a size number larger than 0.6 mm. If the placement method is done by programming the component thickness, then add 0.04 mm to the actual component thickness so that the package sits halfway into the solder paste.
For device placement, please choose a force no greater than 3N to avoid pushing out the solder paste, dislodging the package, solder bridging, or solder balling.