SBOSA93C May   2023  – June 2024 OPT4001-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements
    7. 5.7 Timing Diagram
    8. 5.8 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Spectral Matching to Human Eye
      2. 6.3.2 Automatic Full-Scale Range Setting
      3. 6.3.3 Error Correction Code (ECC) Features
        1. 6.3.3.1 Output Sample Counter
        2. 6.3.3.2 Output CRC
      4. 6.3.4 Output Register FIFO
      5. 6.3.5 Threshold Detection
    4. 6.4 Device Functional Modes
      1. 6.4.1 Modes of Operation
      2. 6.4.2 Interrupt Modes of Operation
      3. 6.4.3 Light Range Selection
      4. 6.4.4 Selecting Conversion Time
      5. 6.4.5 Light Measurement in Lux
      6. 6.4.6 Threshold Detection Calculations
      7. 6.4.7 Light Resolution
    5. 6.5 Programming
      1. 6.5.1 I2C Bus Overview
        1. 6.5.1.1 Serial Bus Address
        2. 6.5.1.2 Serial Interface
      2. 6.5.2 Writing and Reading
        1. 6.5.2.1 High-Speed I2C Mode
        2. 6.5.2.2 Burst Read Mode
        3. 6.5.2.3 General-Call Reset Command
        4. 6.5.2.4 SMBus Alert Response (USON Variant)
  8. 7 Register Maps
    1. 7.1 Register Descriptions
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Electrical Interface
        1. 8.2.1.1 Design Requirements
          1. 8.2.1.1.1 Optical Interface
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Optomechanical Design (PicoStar Variant)
          2. 8.2.1.2.2 Optomechanical Design (USON Variant)
        3. 8.2.1.3 Application Curves (PicoStar Variant)
        4. 8.2.1.4 Application Curves (USON Variant)
    3. 8.3 Best Design Practices
    4. 8.4 Power Supply Recommendations
    5. 8.5 Layout
      1. 8.5.1 Layout Guidelines
        1. 8.5.1.1 Soldering and Handling Recommendations (PicoStar Variant)
          1. 8.5.1.1.1 Solder Paste
          2. 8.5.1.1.2 Package Placement
          3. 8.5.1.1.3 Reflow Profile
          4. 8.5.1.1.4 Special Flexible Printed-Circuit Board (FPCB) Recommendations
          5. 8.5.1.1.5 Rework Process
        2. 8.5.1.2 Soldering and Handling Recommendations (USON Variant)
      2. 8.5.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DNP|6
  • YMN|4
Thermal pad, mechanical data (Package|Pins)
Orderable Information
8.5.1.1.5 Rework Process

Discard the device and do not reattach if the device must be removed from a PCB. To remove the package from the PCB/Flexi cable, heat the solder joints above liquidus temperature. Bake the board at 125°C for 4 hours prior to rework to remove moisture that can crack the PCB or causing delamination. Use a thermal heating profile to remove a package that is close to the profile that mounts the package. Clean the site to remove any excess solder and residue to prepare for installing a new package. Use a mini stencil (localized stencil) to apply solder paste to the land pattern. In case a mini stencil cannot be used because of spacing or other reasons, apply solder paste on the package pads directly, then mount, and reflow.