SBOS993A December   2021  – December 2022 OPT4001

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Description (continued)
  7. 6 Pin Configuration and Functions
  8. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Spectral Matching to Human Eye
      2. 8.3.2 Automatic Full-Scale Range Setting
      3. 8.3.3 Output Register CRC and Counter
        1. 8.3.3.1 Output Sample Counter
        2. 8.3.3.2 Output CRC
      4. 8.3.4 Output Register FIFO
      5. 8.3.5 Threshold Detection
    4. 8.4 Device Functional Modes
      1. 8.4.1 Modes of Operation
      2. 8.4.2 Interrupt Modes of Operation
      3. 8.4.3 Light Range Selection
      4. 8.4.4 Selecting Conversion Time
      5. 8.4.5 Light Measurement in Lux
      6. 8.4.6 Light Resolution
    5. 8.5 Programming
      1. 8.5.1 I2C Bus Overview
        1. 8.5.1.1 Serial Bus Address
        2. 8.5.1.2 Serial Interface
      2. 8.5.2 Writing and Reading
        1. 8.5.2.1 High-Speed I2C Mode
        2. 8.5.2.2 Burst Read Mode
        3. 8.5.2.3 General-Call Reset Command
        4. 8.5.2.4 SMBus Alert Response
    6. 8.6 Register Maps
      1. 8.6.1 ALL Register Map
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Electrical Interface
        1. 9.2.1.1 Design Requirements
          1. 9.2.1.1.1 Optical Interface
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1 Optomechanical Design (PicoStar Variant)
          2. 9.2.1.2.2 Optomechanical Design (SOT-5X3 Variant)
        3. 9.2.1.3 Application Curves (PicoStar Variant)
    3. 9.3 Do's and Don'ts
    4. 9.4 Power Supply Recommendations
    5. 9.5 Layout
      1. 9.5.1 Layout Guidelines
      2. 9.5.2 Layout Example
        1. 9.5.2.1 Soldering and Handling Recommendations (SOT-5X3 Variant)
        2. 9.5.2.2 Soldering and Handling Recommendations (PicoStar Variant)
          1. 9.5.2.2.1 Solder Paste
          2. 9.5.2.2.2 Package Placement
          3. 9.5.2.2.3 Reflow Profile
          4. 9.5.2.2.4 Special Flexible Printed-Circuit Board (FPCB) Recommendations
          5. 9.5.2.2.5 Rework Process
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Mechanical, Packaging, and Orderable Information
    1. 11.1 Tape and Reel Information
    2. 11.2 Package Option Addendum

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)

7.5 Electrical Characteristics

All specifications at TA = 25°C, VDD = 3.3 V, 800-ms conversion-time (CONVERSION_TIME=0xB), automatic full-scale range, white LED and normal-angle incidence of light, unless otherwise specified.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
OPTICAL
PicoStarTM Variant
EvLSB Resolution Lowest auto gain range, 800 ms converion-time 312.5 µlux
EvLSB Lowest auto gain range, 100 ms converion-time 2.5 mlux
EvFS Full-scale illuminance 83886 lux
Angular response (FWHM) 96 °
Drift across temperature Visible Light, Input illuminance = 2000 lux 0.01 %/°C
Linearity Input illuminance > 328 lux 
100 ms conversion-time CONVERSION_TIME=0x8		 2 %
Input illuminance < 328 lux
100 ms conversion-time CONVERSION_TIME=0x8		 5 %
SOT-5X3 Variant
EvLSB Resolution Lowest auto gain range, 800 ms converion-time 437.5 µlux
EvLSB Lowest auto gain range, 100 ms converion-time 3.5 mlux
EvFS Full-scale illuminance 117441 lux
Angular response (FWHM) 120 °
Drift across temperature Visible Light, Input illuminance = 2000 lux 0.015 %/°C
Linearity Input illuminance > 459 lux
100 ms conversion-time CONVERSION_TIME=0x8		 2 %
Input illuminance < 459 lux
100 ms conversion-time CONVERSION_TIME=0x8		 5 %
Common Specifications
Peak irradiance spectral responsivity 550 nm
Effective MANTISSA bits (Register R_MSB & R_LSB) Dependent on Converstion Time selected  (Register CONVERSION_TIME) 9 20 bits
Exponent bits (Register E)  Denotes the full-scale range  4 bits
Ev Measurement output result 2000 lux input(1) 1800 2000 2200 lux
Tconv Light Conversion-time(4) Minimum Selectable (CONVERSION_TIME=0x0), fixed lux range, 2000 lux input 600 µs
Maximum Selectable (CONVERSION_TIME=0xB), fixed lux range, 2000 lux input 800 ms
Light source variation (incandescent, halogen, fluorescent) Bare device, no cover glass 4 %
EvIR Infrared response 850nm Near Infrared 0.2 %
Relative accuracy between gain ranges (2) 0.4 %
Dark Measurement 0 10 mlux
PSRR Power-supply rejection ratio(3) VDD at 3.6 V and 1.6 V 0.1 %/V
POWER SUPPLY
VDD Power supply 1.6 3.6 V
VI2C Power supply for I2C pull up resistor I2C pullup resistor, VDD ≤ VI2C 1.6 5.5 V
IQACTIVE Active Current Dark 22 µA
Full-scale lux 30 µA
IQ Quiescent current Dark 1.6 µA
Full-scale lux 2 uA
POR Power-on-reset threshold 0.8 V
DIGITAL
CIO I/O Pin Capacitance 3 pF
Tss Trigger to Sample Start Low-power shutdown mode 0.5 ms
VIL Low-level input voltage (SDA, SCL, and ADDR) 0 0.3 X VDD V
VIH High-level input voltage (SDA, SCL, and ADDR) 0.7 X VDD 5.5 V
IIL Low-level input current (SDA, SCL, and ADDR) 0.01 0.25(5) µA
VOL Low-level output voltage (SDA and INT) IOL=3mA 0.32 V
IZH Output logic high, high-Z leakage current (SDA, INT) Measured with VDD at pin 0.01 0.25(5) µA
TEMPERATURE
Specified temperature range –40 85 °C
(1) Tested with the white LED calibrated to 2000 lux
(2) Characterized by measuring fixed near-full-scale light levels on the higher adjacent full-scale range setting.
(3) PSRR is the percent change of the measured lux output from the current value, divided by the change in power supply voltage, as characterized by results from 3.6-V and 1.6-V power supplies
(4) The conversion-time, from start of conversion until the data are ready to be read, is the integration-time plus analog-to-digital conversion-time.
(5) The specified leakage current is dominated by the production test equipment limitations. Typical values are much smaller