SBASA69A August 2023 – December 2023 OPT4003-Q1
PRODUCTION DATA
The OPT4003-Q1 is qualified for three soldering reflow operations as per JEDEC JSTD-020.
Excessive heat can discolor the device and affect optical performance.
See the QFN and SON PCB Attachment application note for details on the soldering thermal profile and other information. If the OPT4003-Q1 must be removed from a PCB, discard the device and do not reattach.
As with most optical devices, take special care to make sure that optical surfaces of the device stay clean and free from damage. See the Best Design Practices section for more detailed recommendations. For best optical performance, solder flux and any other possible debris must be cleaned after the soldering processes.
Figure 8-4 shows how to identify pin 1 on the bottom side of the package. Figure 8-5 shows various identification features for pin 1 on the top side of the package.
NOTE: The bottom side of the device features an angled feature to denote pin 1. |