SBASA67 June   2023 OPT4060

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Description (continued)
  7. 6 Pin Configuration and Functions
  8. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Infrared Light Rejection
      2. 8.3.2 Automatic Full-Scale Range Setting
      3. 8.3.3 Output Register CRC and Counter
        1. 8.3.3.1 Output Sample Counter
        2. 8.3.3.2 Output CRC
        3. 8.3.3.3 Threshold Detection
    4. 8.4 Device Functional Modes
      1. 8.4.1 Modes of Operation
      2. 8.4.2 Interrupt Modes of Operation
      3. 8.4.3 Light Range Selection
      4. 8.4.4 Selecting Conversion Time
      5. 8.4.5 Light and Color Measurement
        1. 8.4.5.1 Determining ADC Codes for Each Channel
        2. 8.4.5.2 Lux and Color Calculations
        3. 8.4.5.3 Threshold Detection Calculations
      6. 8.4.6 Light Resolution
    5. 8.5 Programming
      1. 8.5.1 I2C Bus Overview
        1. 8.5.1.1 Serial Bus Address
        2. 8.5.1.2 Serial Interface
      2. 8.5.2 Writing and Reading
        1. 8.5.2.1 High-Speed I2C Mode
        2. 8.5.2.2 Burst Read Mode
        3. 8.5.2.3 General-Call Reset Command
        4. 8.5.2.4 SMBus Alert Response
    6. 8.6 Register Maps
      1. 8.6.1 Register Map
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Electrical Interface
        1. 9.2.1.1 Design Requirements
          1. 9.2.1.1.1 Optical Interface
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1 Optomechanical Design
        3. 9.2.1.3 Application Curve
    3. 9.3 Best Design Practices
    4. 9.4 Power Supply Recommendations
    5. 9.5 Layout
      1. 9.5.1 Layout Guidelines
      2. 9.5.2 Layout Example
      3. 9.5.3 Soldering and Handling Recommendations
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10.5 Electrostatic Discharge Caution

GUID-D6F43A01-4379-4BA1-8019-E75693455CED-low.gif This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.