SBASA67 June   2023 OPT4060

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Revision History
  6. Description (continued)
  7. Pin Configuration and Functions
  8. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  9. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Infrared Light Rejection
      2. 8.3.2 Automatic Full-Scale Range Setting
      3. 8.3.3 Output Register CRC and Counter
        1. 8.3.3.1 Output Sample Counter
        2. 8.3.3.2 Output CRC
        3. 8.3.3.3 Threshold Detection
    4. 8.4 Device Functional Modes
      1. 8.4.1 Modes of Operation
      2. 8.4.2 Interrupt Modes of Operation
      3. 8.4.3 Light Range Selection
      4. 8.4.4 Selecting Conversion Time
      5. 8.4.5 Light and Color Measurement
        1. 8.4.5.1 Determining ADC Codes for Each Channel
        2. 8.4.5.2 Lux and Color Calculations
        3. 8.4.5.3 Threshold Detection Calculations
      6. 8.4.6 Light Resolution
    5. 8.5 Programming
      1. 8.5.1 I2C Bus Overview
        1. 8.5.1.1 Serial Bus Address
        2. 8.5.1.2 Serial Interface
      2. 8.5.2 Writing and Reading
        1. 8.5.2.1 High-Speed I2C Mode
        2. 8.5.2.2 Burst Read Mode
        3. 8.5.2.3 General-Call Reset Command
        4. 8.5.2.4 SMBus Alert Response
    6. 8.6 Register Maps
      1. 8.6.1 Register Map
  10. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Electrical Interface
        1. 9.2.1.1 Design Requirements
          1. 9.2.1.1.1 Optical Interface
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1 Optomechanical Design
        3. 9.2.1.3 Application Curve
    3. 9.3 Best Design Practices
    4. 9.4 Power Supply Recommendations
    5. 9.5 Layout
      1. 9.5.1 Layout Guidelines
      2. 9.5.2 Layout Example
      3. 9.5.3 Soldering and Handling Recommendations
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Register Maps

Figure 8-8 ALL Register Map
ADD D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0
00h EXPONENT_CH0 RESULT_MSB_CH0
01h RESULT_LSB_CH0 COUNTER_CH0 CRC_CH0
02h EXPONENT_CH1 RESULT_MSB_CH1
03h RESULT_LSB_CH1 COUNTER_CH1 CRC_CH1
04h EXPONENT_CH2 RESULT_MSB_CH2
05h RESULT_LSB_CH2 COUNTER_CH2 CRC_CH2
06h EXPONENT_CH3 RESULT_MSB_CH3
07h RESULT_LSB_CH3 COUNTER_CH3 CRC_CH3
08h THRESHOLD_L_EXPONENT THRESHOLD_L_RESULT
09h THRESHOLD_H_EXPONENT THRESHOLD_H_RESULT
0Ah QWAKE 0 RANGE CONVERSION_TIME OPERATING_MODE LATCH INT_POL FAULT_COUNT
0Bh 128 THRESHOLD_CH_SEL INT_DIR INT_CFG 0 I2C_BURST
0Ch 0 OVERLOAD_FLAG CONVERSION_READY_FLAG FLAG_H FLAG_L
11h 0 DIDL DIDH