SCPS232B March   2012  – March 2016 PCA9515B

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Switching Characteristics
    8. 6.8 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Two-Channel Bidirectional Buffer
      2. 8.3.2 Bidirectional Voltage-Level Translation
      3. 8.3.3 Active-High Enable Input
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Community Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted) (1)
MIN MAX UNIT
VCC Supply voltage –0.5 7 V
VI Enable input voltage (2) –0.5 7 V
VI/O I2C bus voltage(2) –0.5 7 V
IIK Input clamp current VI < 0 –50 mA
IOK Output clamp current VO < 0 –50 mA
IO Continuous output current ±50 mA
Continuous current through VCC or GND ±100 mA
Tstg Storage temperature –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed.

6.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±1000
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

MIN MAX UNIT
VCC Supply voltage 2.3 3.6 V
VIH High-level input voltage SDA and SCL inputs 0.7 × VCC 5.5 V
EN input 2 5.5
VIL (1) Low-level input voltage SDA and SCL inputs –0.5 0.3 × VCC V
EN input –0.5 0.8
VILc (1) SDA and SCL low-level input voltage contention –0.5 0.4 V
IOL Low-level output current VCC = 2.3 V 6 mA
VCC = 3 V 6
TA Operating free-air temperature –40 85 °C
(1) VIL specification is for the EN input and the first low level seen by the SDAx and SCLx lines. VILc is for the second and subsequent low levels seen by the SDAx and SCLx lines. VILc must be at least 70 mV below VOL.

6.4 Thermal Information

THERMAL METRIC(1) PCA9515B UNIT
DGK (VSSOP)
8 PINS
RθJA Junction-to-ambient thermal resistance(2) 170.8 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 62.9 °C/W
RθJB Junction-to-board thermal resistance 91.6 °C/W
ψJT Junction-to-top characterization parameter 9.5 °C/W
ψJB Junction-to-board characterization parameter 90.2 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.
(2) The package thermal impedance is calculated in accordance with JESD 51-7.

6.5 Electrical Characteristics

over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS VCC MIN TYP(1) MAX UNIT
VIK Input diode clamp voltage II = –18 mA 2.3 V to 3.6 V –1.2 V
VOL Low-level output voltage SDAx, SCLx IOL = 20 μA or 6 mA 2.3 V to 3.6 V 0.47 0.52 0.6 V
VOL – VILc Low-level input voltage below low-level output voltage SDAx, SCLx guaranteed by design 2.3 V to 3.6 V 120 mV
ICC Quiescent supply current Both channels high,
SDAx = SCLx = VCC 		2.7 V 0.5 3 mA
3.6 V 0.5 3
Both channels low,
SDA0 = SCL0 = GND and
SDA1 = SCL1 = open; or
SDA0 = SCL0 = open and
SDA1 = SCL1 = GND		 2.7 V 1 4
3.6 V 1 4
In contention,
SDAx = SCLx = GND		 2.7 V 1 4
3.6 V 1 4
II Input current SDAx, SCLx VI = 3.6 V 2.3 V to 3.6 V ±1 μA
VI = 0.2 V 3
EN VI = VCC ±1
VI = 0.2 V –10 –20
Ioff Leakage current SDAx, SCLx VI = 3.6 V EN = L or H 0 V 0.5 μA
VI = GND 0.5
II(ramp) Leakage current during power up SDAx, SCLx VI = 3.6 V EN = L or H 0 V to 2.3 V 1 μA
Cin Input capacitance EN VI = 3 V or GND 3.3 V 7 9 pF
SDAx, SCLx EN = H 3.3 V 7 9
(1) All typical values are at nominal supply voltage (VCC = 2.5 V or 3.3 V) and TA = 25°C.

6.6 Timing Requirements

over recommended operating free-air temperature range (unless otherwise noted) (see Figure 3)
VCC MIN MAX UNIT
tsu Setup time, EN↑ before Start condition 2.5 V ± 0.2 V 100 ns
3.3 V ± 0.3 V 100
th Hold time, EN↓ after Stop condition 2.5 V ± 0.2 V 130 ns
3.3 V ± 0.3 V 100

6.7 Switching Characteristics

over recommended operating free-air temperature range, CL ≤ 100 pF (unless otherwise noted)
PARAMETER FROM
(INPUT)		 TO
(OUTPUT)		 VCC MIN TYP(1) MAX UNIT
tPZL Propagation delay time(2) SDA0, SCL0 or SDA1, SCL1 SDA1, SCL1 or SDA0, SCL0 2.5 V ± 0.2 V 45 82 130 ns
3.3 V ± 0.3 V 45 68 120
tPLZ 2.5 V ± 0.2 V 33 113 190
3.3 V ± 0.3 V 33 102 180
ttHL Output transition time(2)
(SDAx, SCLx)		 80% 20% 2.5 V ± 0.2 V 57 ns
3.3 V ± 0.3 V 58
ttLH 20% 80% 2.5 V ± 0.2 V 148
3.3 V ± 0.3 V 147
(1) All typical values are at nominal supply voltage (VCC = 2.5 V or 3.3 V) and TA = 25°C.
(2) Different load resistance and capacitance alter the RC time constant, thereby changing the propagation delay and transition times.

6.8 Typical Characteristics

PCA9515B D004_SCPS232.gif Figure 1. Output Low Voltage (VOL) vs. Output Low Current (IOL) for SCL0 at Different VCC
PCA9515B D003_SCPS232.gif Figure 2. Output Low Voltage (VOL) vs. Output Low Current (IOL) for SCL0 at Different Temperatures for VCC= 5 V