SCPS124H September   2006  – March 2021 PCA9534

PRODUCTION DATA  

  1. 1 Features
  2. 2 Description
  3. 3 Revision History
  4. 4 Description (Continued)
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Resistance Characteristics
    5. 7.5 Electrical Characteristics
    6. 7.6 I2C Interface Timing Requirements
    7. 7.7 Switching Characteristics
    8. 7.8 Typical Characteristics
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Functional Block Diagram
    2. 9.2 Device Functional Modes
      1. 9.2.1 Power-On Reset
      2. 9.2.2 I/O Port
      3. 9.2.3 Interrupt Output ( INT)
        1. 9.2.3.1 Interrupt Errata
          1. 9.2.3.1.1 Description
          2. 9.2.3.1.2 System Impact
          3. 9.2.3.1.3 System Workaround
    3. 9.3 Programming
      1. 9.3.1 I2C Interface
      2. 9.3.2 Register Map
        1. 9.3.2.1 Device Address
        2. 9.3.2.2 Control Register And Command Byte
        3. 9.3.2.3 Register Descriptions
        4. 9.3.2.4 Bus Transactions
          1. 9.3.2.4.1 Writes
          2. 9.3.2.4.2 Reads
  10. 10Application Information Disclaimer
    1. 10.1 Application Information
      1. 10.1.1 Typical Application
        1. 10.1.1.1 Design Requirements
          1. 10.1.1.1.1 Minimizing ICC When The I/O Controls Leds
  11. 11Power Supply Recommendations
    1. 11.1 Power-On Reset Requirements
  12. 12Device and Documentation Support
    1. 12.1 Receiving Notification of Documentation Updates
    2. 12.2 Support Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.4 Thermal Resistance Characteristics

THERMAL METRIC(1) PCA9535 UNIT
DB
(SSOP)		 DBQ
(SSOP)		 DVG
(TVSOP)		 DW
(SOIC)		 PW
(TSSOP)		 RGV
(VQFN)
16 PINS 16 PINS 16 PINS 16 PINS 16 PINS 16 PINS °C/W
R θJA Junction-to-ambient thermal resistance 92.9 61 86 108.8 48.4 43.6 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application report.