SCPS141J September   2006  – March 2021 PCA9534A

PRODUCTION DATA  

  1. 1 Features
  2. 2 Description
  3. 3 Revision History
  4. 4 Description (Continued)
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Resistance Characteristics
    5. 7.5 Electrical Characteristics
    6. 7.6 I2C Interface Timing Requirements
    7. 7.7 Switching Characteristics
    8. 7.8 Typical Characteristics
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Functional Block Diagram
    2. 9.2 Device Functional Modes
      1. 9.2.1 Power-On Reset
      2. 9.2.2 I/O Port
      3. 9.2.3 Interrupt Output ( INT)
        1. 9.2.3.1 Interrupt Errata
          1. 9.2.3.1.1 Description
          2. 9.2.3.1.2 System Impact
          3. 9.2.3.1.3 System Workaround
    3. 9.3 Programming
      1. 9.3.1 I2C Interface
      2. 9.3.2 Register Map
        1. 9.3.2.1 Device Address
        2. 9.3.2.2 Control Register And Command Byte
        3. 9.3.2.3 Register Descriptions
        4. 9.3.2.4 Bus Transactions
          1. 9.3.2.4.1 Writes
          2. 9.3.2.4.2 Reads
  10. 10Application Information Disclaimer
    1. 10.1 Application Information
      1. 10.1.1 Typical Application
        1. 10.1.1.1 Design Requirements
          1. 10.1.1.1.1 Minimizing ICC When The I/O Controls Leds
  11. 11Power Supply Recommendations
    1. 11.1 Power-On Reset Requirements
  12. 12Device and Documentation Support
    1. 12.1 Trademarks
    2. 12.2 Electrostatic Discharge Caution
    3. 12.3 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

12.2 Electrostatic Discharge Caution

GUID-D6F43A01-4379-4BA1-8019-E75693455CED-low.gif This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.