SCPS129K August   2005  – March 2021 PCA9535

PRODUCTION DATA  

  1. 1 Features
  2. 2 Description
  3. 3 Revision History
  4. 4 Description Continued
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Resistance Characteristics
    5. 6.5 Electrical Characteristics
    6. 6.6 I2C Interface Timing Requirements
    7. 6.7 Switching Characteristics
    8. 6.8 Typical Characteristics
  7. 7 Parameter Measurement Information
    1.     16
  8. 8 Detailed Description
    1. 8.1 Functional Block Diagram
    2. 8.2 Device Functional Modes
      1. 8.2.1 Power-On Reset
      2. 8.2.2 I/O Port
      3. 8.2.3 Interrupt ( INT) Output
        1. 8.2.3.1 Interrupt Errata
          1.        24
          2.        25
          3.        26
    3. 8.3 Programming
      1. 8.3.1 I2C Interface
      2. 8.3.2 Register Map
        1. 8.3.2.1 Device Address
        2. 8.3.2.2 Control Register And Command Byte
        3. 8.3.2.3 Register Descriptions
        4. 8.3.2.4 Bus Transactions
          1. 8.3.2.4.1 Writes
          2. 8.3.2.4.2 Reads
  9. 9 Application Information Disclaimer
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
        1. 9.2.1.1 Minimizing ICC When I/O Is Used To Control Led
  10. 10Power Supply Recommendations
    1. 10.1 Power-On Reset Requirements
  11. 11Device and Documentation Support
    1. 11.1 Receiving Notification of Documentation Updates
    2. 11.2 Support Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Resistance Characteristics

THERMAL METRIC(1) PCA9535 UNIT
DB
(SSOP)		 DBQ
(SSOP)		 DVG
(TVSOP)		 DW
(SOIC)		 PW
(TSSOP)		 RGV
(VQFN)
16 PINS 16 PINS 16 PINS 16 PINS 16 PINS 16 PINS °C/W
R θJA Junction-to-ambient thermal resistance 92.9 61 86 108.8 48.4 43.6 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application report.