SCPS125H April   2006  – March 2022 PCA9536

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 I2C Interface Timing Requirements
    7. 6.7 Switching Characteristics
    8. 6.8 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 I/O Port
    4. 8.4 Device Functional Modes
      1. 8.4.1 Power-On Reset
      2. 8.4.2 Powered-Up
    5. 8.5 Programming
      1. 8.5.1 I2C Interface
    6. 8.6 Register Maps
      1. 8.6.1 Device Address
      2. 8.6.2 Control Register and Command Byte
      3. 8.6.3 Register Descriptions
      4. 8.6.4 Bus Transactions
        1. 8.6.4.1 Writes
        2. 8.6.4.2 Reads
  9. 9 Application Information Disclaimer
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
        1. 9.2.1.1 Minimizing ICC When I/Os Control LEDs
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
    1. 10.1 Power-On Reset Errata
    2. 10.2 System Impact
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from Revision G (June 2014) to Revision H (March 2022)

  • Changed all instances of legacy terminology to controller and target where I2C is mentioned.Go
  • Deleted the DSBGA (YZP) package informationGo
  • Added the Simplified Schematic to the front pageGo
  • Removed packaging information from the Absolute Maximum Ratings tableGo
  • Added Tstg to the Absolute Maximum Ratings tableGo
  • Added the Thermal Information tableGo
  • Deleted VPOR from the Electrical Characteristics Go
  • Added VPORR and VPORF to the Electrical Characteristics Go
  • Changed the ICC stand by mode current max values for 5.5 V from 1 to 1.8 μA; 3.6 V from 0.9 to 1.2 μA; and 2.7 V from 0.8 to 1 μA in the Electrical Characteristics Go
  • Changed the tvd(data) and tvd(ack) MAX values from: 1 μs to: 3.45 μs in the Standard Mode timingGo
  • Changed the ticr, tocf, and tocf MIN values in the Fast Mode timingGo
  • Added the Overview sectionGo
  • Added the Device Functional Modes sectionGo
  • Added Detailed Design Procedure sectionGo
  • Added Application Curves sectionGo
  • Added the Layout sectionGo

Changes from Revision F (September 2008) to Revision G (June 2014)

  • Added Power-On Reset Errata section.Go