SCPS143G June   2009  – March 2021 PCA9548A

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 I2C Interface Timing Requirements
    7. 6.7 Reset Timing Requirements
    8. 6.8 Switching Characteristics
    9. 6.9 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
      1. 8.4.1 RESET Input
        1. 8.4.1.1 RESET Errata
          1. 8.4.1.1.1 System Impact
          2. 8.4.1.1.2 System Workaround
      2. 8.4.2 Power-On Reset
    5. 8.5 Programming
      1. 8.5.1 I2C Interface
    6. 8.6 Register Maps
      1. 8.6.1 Device Address
      2. 8.6.2 Control Register
      3. 8.6.3 Bus Transactions
        1. 8.6.3.1 Writes
        2. 8.6.3.2 Reads
  9. 9 Application Information Disclaimer
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
    1. 10.1 Power-On Reset Requirements
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC(1) PCA9548A UNIT
DB (SSOP) DGV (TVSOP) DW (SOIC) PW (TSSOP) RGE (VQFN)
24 PINS
RθJA Junction-to-ambient thermal resistance 89.1 99.6 73.2 108.8

57.2

 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 51.1 31.1 41.3 54.1 62.5 °C/W
RθJB Junction-to-board thermal resistance 46.6 53.1 42.9

62.7

 34.4 °C/W
ψJT Junction-to-top characterization parameter 18.5 0.9 15.3

10.9

3.8

 °C/W
ψJB Junction-to-board characterization parameter 46.3 52.6 42.6 62.3 34.4 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A N/A N/A N/A 15.5 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.