SCPS131J August   2005  – March 2021 PCA9555

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 I2C Interface Timing Requirements
    7. 6.7 Switching Characteristics
    8. 6.8 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Device Features
      1. 8.3.1 Power-On Reset (POR)
      2. 8.3.2 I/O Port
    4. 8.4 Device Functional Modes
      1. 8.4.1 Interrupt ( INT) Output
        1. 8.4.1.1 Interrupt Errata
          1. 8.4.1.1.1 INT Description
          2. 8.4.1.1.2 System Impact
          3. 8.4.1.1.3 System Workaround
    5. 8.5 Programming
      1. 8.5.1 I2C Interface
      2. 8.5.2 Register Map
        1. 8.5.2.1 Device Address
        2. 8.5.2.2 Control Register And Command Byte
        3. 8.5.2.3 Register Descriptions
        4. 8.5.2.4 Bus Transactions
          1. 8.5.2.4.1 Writes
          2. 8.5.2.4.2 Reads
  9. 9 Application Information Disclaimer
    1. 9.1 Application Information
      1. 9.1.1 Typical Application
        1. 9.1.1.1 Design Requirements
        2. 9.1.1.2 Design Requirements
          1. 9.1.1.2.1 Minimizing ICC When I/O Is Used To Control Led
        3. 9.1.1.3 Application Curves
  10. 10Power Supply Recommendations
    1. 10.1 Power-On Reset Requirements
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Receiving Notification of Documentation Updates
    2. 12.2 Support Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC(1) PCA9555 UNIT
DB
(SSOP)		 DBQ
(QSOP)		 DGV
(TVSOP)		 DW
(SOIC)		 PW
(TSSOP)		 RGE
(QFN)
24 PINS 24 PINS 24 PINS 24 PINS 24 PINS 24 PINS
RθJA Junction-to-ambient thermal resistance 92.9 81.8 105.4 66.7 108.8 48.4 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 53.5 39.3 36.7 36.7 54 58.1 °C/W
RθJB Junction-to-board thermal resistance 50.4 36.0 50.8 36.7 62.8 27.1 °C/W
ψJT Junction-to-top characterization parameter 21.9 7.6 2.4 13.1 11.1 3.3 °C/W
ψJB Junction-to-board characterization parameter 50.1 35.6 50.3 62.3 62.3 27.2 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance n/a n/a n/a n/a n/a 15.3 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.