SCPS133K December   2005  – December 2024 PCA9557

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 I2C Interface Timing Requirements
    7. 5.7 Reset Timing Requirements
    8. 5.8 Switching Characteristics
    9. 5.9 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Functional Block Diagram
    2. 7.2 Feature Description
      1. 7.2.1 RESET
        1. 7.2.1.1 RESET Errata
          1. 7.2.1.1.1 System Impact
          2. 7.2.1.1.2 System Workaround
      2. 7.2.2 Power-On Reset
    3. 7.3 Programming
      1. 7.3.1 I2C Interface
    4. 7.4 Register Maps
      1. 7.4.1 Device Address
      2. 7.4.2 Control Register And Command Byte
      3. 7.4.3 Register Descriptions
        1. 7.4.3.1 Bus Transactions
          1. 7.4.3.1.1 Writes
          2. 7.4.3.1.2 Reads
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Detailed Design Procedure
        1. 8.2.1.1 Minimizing ICC when I/O is Used to Control LED
    3. 8.3 Power Supply Recommendations
      1. 8.3.1 Power-On Reset Errata
        1. 8.3.1.1 System Impact
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9.5 Electrostatic Discharge Caution

PCA9557 This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.