SCPS133K December   2005  – December 2024 PCA9557

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 I2C Interface Timing Requirements
    7. 5.7 Reset Timing Requirements
    8. 5.8 Switching Characteristics
    9. 5.9 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Functional Block Diagram
    2. 7.2 Feature Description
      1. 7.2.1 RESET
        1. 7.2.1.1 RESET Errata
          1. 7.2.1.1.1 System Impact
          2. 7.2.1.1.2 System Workaround
      2. 7.2.2 Power-On Reset
    3. 7.3 Programming
      1. 7.3.1 I2C Interface
    4. 7.4 Register Maps
      1. 7.4.1 Device Address
      2. 7.4.2 Control Register And Command Byte
      3. 7.4.3 Register Descriptions
        1. 7.4.3.1 Bus Transactions
          1. 7.4.3.1.1 Writes
          2. 7.4.3.1.2 Reads
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Detailed Design Procedure
        1. 8.2.1.1 Minimizing ICC when I/O is Used to Control LED
    3. 8.3 Power Supply Recommendations
      1. 8.3.1 Power-On Reset Errata
        1. 8.3.1.1 System Impact
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.4 Thermal Information

over operating free-air temperature range (unless otherwise noted)
THERMAL METRIC(1) PCA9557 UNIT
D (SSOP) DB (SSOP) DGV (SSOP) PW (SSOP) RGV (VQFN) RGY (VQFN)
16 PINS 16 PINS 16 PINS 16 PINS 16 PINS 16 PINS
RθJA Junction-to-ambient thermal resistance 77.2 82 120 98.0 44.5 47 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 40.0 30.7 40.1 °C/W
RθJB Junction-to-board thermal resistance 39.2 52.7 20.2 °C/W
ψJT Junction-to-top characterization parameter 6.5 1.0 0.9 °C/W
ψJB Junction-to-board characterization parameter 38.8 52.1 20.2 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A N/A 5.7 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.